Inventor
KABIR NAFEES
US16 patents
Patents
16 patentsUS11444024B2Sep 13, 2022
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP10 citations84
US11342227B2May 24, 2022
Stacked transistor structures with asymmetrical terminal interconnects
INTEL CORP3 citations73
US11239156B2Feb 1, 2022
Planar slab vias for integrated circuit interconnects
INTEL CORP5 citations72
US12027458B2Jul 2, 2024
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP2 citations71
US11289421B2Mar 29, 2022
Methods and structures for improved electrical contact between bonded integrated circuit interfaces
INTEL CORP2 citations69
US12341092B2Jun 24, 2025
Planar slab vias for integrated circuit interconnects
INTEL CORP0 citations62
US11610810B2Mar 21, 2023
Maskless air gap enabled by a single damascene process
INTEL CORP0 citations62
US11594673B2Feb 28, 2023
Two terminal spin orbit memory devices and methods of fabrication
INTEL CORP0 citations62
US12482744B2Nov 25, 2025
Subtractively patterned interconnect structures for integrated circuits
INTEL CORP0 citations61
US12087836B2Sep 10, 2024
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting
INTEL CORP0 citations60
US11837644B2Dec 5, 2023
Contact over active gate structures with metal oxide-caped contacts to inhibit shorting
INTEL CORP0 citations60
US11424160B2Aug 23, 2022
Self-aligned local interconnects
INTEL CORP0 citations60
US11887887B2Jan 30, 2024
Interconnect structures and methods of fabrication
INTEL CORP0 citations59
US11784123B2Oct 10, 2023
Methods and structures for improved electrical contact between bonded integrated circuit interfaces
INTEL CORP0 citations59
US11404307B2Aug 2, 2022
Interconnect structures and methods of fabrication
INTEL CORP0 citations59
US11404482B2Aug 2, 2022
Self-aligned repeatedly stackable 3D vertical RRAM
INTEL CORP0 citations52