Inventor
TSAI YU-HSUAN
DE14 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YU-HSUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
12 patentsUS10224298B2Mar 5, 2019
Semiconductor package device having glass transition temperature greater than binding layer temperature
ADVANCED SEMICONDUCTOR ENG2 citations71
US11081413B2Aug 3, 2021
Semiconductor package with inner and outer cavities
ADVANCED SEMICONDUCTOR ENG3 citations69
US10720751B2Jul 21, 2020
Optical package structure, optical module, and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US10526200B2Jan 7, 2020
Semiconductor device package including cover including tilted inner sidewall
ADVANCED SEMICONDUCTOR ENG1 citations61
US10170658B2Jan 1, 2019
Semiconductor package structures and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations61
US11101189B2Aug 24, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US11565934B2Jan 31, 2023
Semiconductor package structures and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations56
US10734337B2Aug 4, 2020
Semiconductor package device having glass transition temperature greater than binding layer temperature
ADVANCED SEMICONDUCTOR ENG0 citations51
US9850124B2Dec 26, 2017
Semiconductor device package for reducing parasitic light and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations51
US10689248B2Jun 23, 2020
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations48
US11174157B2Nov 16, 2021
Semiconductor device packages and methods of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations43
US10841679B2Nov 17, 2020
Microelectromechanical systems package structure
ADVANCED SEMICONDUCTOR ENG0 citations39