Inventor

WINDHAM MICHAEL

US4 patents

Patents

4 patents

US10174437B2Jan 8, 2019

Wafer electroplating chuck assembly

APPLIED MATERIALS INC3 citations69

US11982008B2May 14, 2024

Electroplating system

APPLIED MATERIALS INC0 citations58

US11578422B2Feb 14, 2023

Electroplating system

APPLIED MATERIALS INC0 citations58

US11268208B2Mar 8, 2022

Electroplating system

APPLIED MATERIALS INC0 citations58