Inventor
KANG JIHO
US4 patents
Patents
4 patentsUS9716066B2Jul 25, 2017
Interconnect structure comprising fine pitch backside metal redistribution lines combined with vias
INTEL CORP16 citations77
US9818710B2Nov 14, 2017
Anchored interconnect
INTEL CORP2 citations69
US9748180B2Aug 29, 2017
Through-body via liner deposition
INTEL CORP5 citations66
US11710694B2Jul 25, 2023
Integrated circuit structures with contoured interconnects
INTEL CORP0 citations47