Inventor
KOTHARI HITEN
US10 patents
⚠️ This page may combine multiple inventors who share the name “KOTHARI HITEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS11393754B2Jul 19, 2022
Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication
INTEL CORP3 citations70
US9818710B2Nov 14, 2017
Anchored interconnect
INTEL CORP2 citations69
US9721886B2Aug 1, 2017
Preservation of fine pitch redistribution lines
INTEL CORP5 citations67
US12406931B2Sep 2, 2025
Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication
INTEL CORP0 citations60
US12261122B2Mar 25, 2025
Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication
INTEL CORP0 citations60
US9530740B2Dec 27, 2016
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
INTEL CORP0 citations50
US11430948B2Aug 30, 2022
Resistive random access memory device with switching multi-layer stack and methods of fabrication
INTEL CORP0 citations46
US11489112B2Nov 1, 2022
Resistive random access memory device and methods of fabrication
INTEL CORP0 citations43
LEE KEVIN J
2 patentsUS9142510B2Sep 22, 2015
3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach
LEE KEVIN J17 citations90
US9449913B2Sep 20, 2016
3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias
LEE KEVIN J18 citations82