Inventor

YEOH ANDREW W

US23 patents

⚠️ This page may combine multiple inventors who share the name “YEOH ANDREW W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YEOH ANDREW W

INTEL CORP

Contact over active gate structures for advanced integrated circuit structure fabrication

Contact over active gate structures for advanced integrated circuit structure fabrication

Thickened stress relief and power distribution layer

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Plugs for interconnect lines for advanced integrated circuit structure fabrication

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Multi version library cell handling and integrated circuit structures fabricated therefrom

Etch-stop layer topography for advanced integrated circuit structure fabrication

Etch-stop layer topography for advanced integrated circuit structure fabrication

Plugs for interconnect lines for advanced integrated circuit structure fabrication

Anchored interconnect

3D integrated circuit package with window interposer

Multi version library cell handling and integrated circuit structures fabricated therefrom

Heterogeneous metal line compositions for advanced integrated circuit structure fabrication

Contact over active gate structures for advanced integrated circuit structure fabrication

Thickened stress relief and power distribution layer

Necked interconnect fuse structure for integrated circuits

Plugs for interconnect lines for advanced integrated circuit structure fabrication

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

LEE KEVIN J

3D interconnect structure comprising through-silicon vias combined with fine pitch backside metal redistribution lines fabricated using a dual damascene type approach

3D interconnect structure comprising fine pitch single damascene backside metal redistribution lines combined with through-silicon vias

MALLIK DEBENDRA

3D integrated circuit package with window interposer