Inventor
YAMASAKI HIDEAKI
JP48 patents
⚠️ This page may combine multiple inventors who share the name “YAMASAKI HIDEAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
41 patentsUS7482283B2Jan 27, 2009
Thin film forming method and thin film forming device
TOKYO ELECTRON LTD476 citations99
US6966936B2Nov 22, 2005
Processing system, evacuating system for processing system, low-pressure CVD system, and evacuating system and trapping device for low-pressure CVD system
TOKYO ELECTRON LTD69 citations97
US6548112B1Apr 15, 2003
Apparatus and method for delivery of precursor vapor from low vapor pressure liquid sources to a CVD chamber
TOKYO ELECTRON LTD76 citations97
US6399484B1Jun 4, 2002
Semiconductor device fabricating method and system for carrying out the same
TOKYO ELECTRON LTD88 citations97
US6913996B2Jul 5, 2005
Method of forming metal wiring and semiconductor manufacturing apparatus for forming metal wiring
TOKYO ELECTRON LTD20 citations92
US6797068B1Sep 28, 2004
Film forming unit
TOKYO ELECTRON LTD22 citations92
US6436203B1Aug 20, 2002
CVD apparatus and CVD method
TOKYO ELECTRON LTD21 citations92
US6089184AJul 18, 2000
CVD apparatus and CVD method
TOKYO ELECTRON LTD35 citations92
US6846711B2Jan 25, 2005
Method of making a metal oxide capacitor, including a barrier film
TOKYO ELECTRON LTD16 citations84
US7674710B2Mar 9, 2010
Method of integrating metal-containing films into semiconductor devices
TOKYO ELECTRON LTD10 citations83
US7427426B2Sep 23, 2008
CVD method for forming metal film by using metal carbonyl gas
TOKYO ELECTRON LTD6 citations74
US9330936B2May 3, 2016
Method for depositing metal layers on germanium-containing films using metal chloride precursors
TOKYO ELECTRON LTD6 citations73
US12188125B2Jan 7, 2025
Showerhead and substrate processing apparatus
TOKYO ELECTRON LTD2 citations72
US8029621B2Oct 4, 2011
Raw material feeding device, film formation system and method for feeding gaseous raw material
TOKYO ELECTRON LTD6 citations63
US6548398B1Apr 15, 2003
Production method of semiconductor device and production device therefor
TOKYO ELECTRON LTD2 citations63
US6489198B2Dec 3, 2002
Semiconductor device and method of manufacturing the same
TOKYO ELECTRON LTD2 citations63
US6486063B2Nov 26, 2002
Semiconductor device manufacturing method for a copper connection
TOKYO ELECTRON LTD5 citations63
US10903086B2Jan 26, 2021
Titanium silicide region forming method
TOKYO ELECTRON LTD0 citations62
US7063871B2Jun 20, 2006
CVD process capable of reducing incubation time
TOKYO ELECTRON LTD4 citations62
US12553128B2Feb 17, 2026
Particle suppression method
TOKYO ELECTRON LTD0 citations60
US12227843B2Feb 18, 2025
Film forming method and tungsten film
TOKYO ELECTRON LTD0 citations60
US12221693B2Feb 11, 2025
Stress reducing method
TOKYO ELECTRON LTD0 citations60
US11150142B2Oct 19, 2021
Thermocouple-fixing jig
TOKYO ELECTRON LTD0 citations60
US11069512B2Jul 20, 2021
Film forming apparatus and gas injection member used therefor
TOKYO ELECTRON LTD1 citations59
US10968514B2Apr 6, 2021
Substrate mounting table
TOKYO ELECTRON LTD0 citations56
US9257278B2Feb 9, 2016
Method for forming TiN and storage medium
TOKYO ELECTRON LTD1 citations52
US7960278B2Jun 14, 2011
Method of film deposition
TOKYO ELECTRON LTD0 citations52
US7879399B2Feb 1, 2011
CV method using metal carbonyl gas
TOKYO ELECTRON LTD0 citations52
US7344754B2Mar 18, 2008
Film formation method
TOKYO ELECTRON LTD1 citations52
US6919268B1Jul 19, 2005
Method of manufacturing a WN contact plug
TOKYO ELECTRON LTD0 citations52
US9133548B2Sep 15, 2015
TiN film forming method and storage medium
TOKYO ELECTRON LTD0 citations51
US7456109B2Nov 25, 2008
Method for cleaning substrate processing chamber
TOKYO ELECTRON LTD0 citations51
US7361595B2Apr 22, 2008
Transition metal thin film forming method
TOKYO ELECTRON LTD0 citations51
US12584220B2Mar 24, 2026
Showerhead and substrate processing apparatus
TOKYO ELECTRON LTD0 citations50
US11984319B2May 14, 2024
Substrate processing method and film forming system
TOKYO ELECTRON LTD0 citations50
US11718910B2Aug 8, 2023
Pre-coating method and film forming method
TOKYO ELECTRON LTD0 citations48
US11414742B2Aug 16, 2022
Substrate processing apparatus, substrate processing method, and storage medium
TOKYO ELECTRON LTD0 citations43
US10546753B2Jan 28, 2020
Method of removing silicon oxide film
TOKYO ELECTRON LTD0 citations41
US10731248B2Aug 4, 2020
Vacuum processing apparatus and operation method thereof
TOKYO ELECTRON LTD0 citations38
US10519542B2Dec 31, 2019
Purging method
TOKYO ELECTRON LTD0 citations38
US10738374B2Aug 11, 2020
Method of performing a surface treatment on a mounting table, the mounting table and a plasma processing apparatus
TOKYO ELECTRON LTD0 citations36
IBM
5 patentsUS7067422B2Jun 27, 2006
Method of forming a tantalum-containing gate electrode structure
IBM23 citations92
US6989321B2Jan 24, 2006
Low-pressure deposition of metal layers from metal-carbonyl precursors
IBM41 citations92
US6924223B2Aug 2, 2005
Method of forming a metal layer using an intermittent precursor gas flow process
IBM32 citations91
US7078341B2Jul 18, 2006
Method of depositing metal layers from metal-carbonyl precursors
IBM12 citations84
US7189431B2Mar 13, 2007
Method for forming a passivated metal layer
IBM5 citations62