Inventor
CHU CHENG-I
TW6 patents
⚠️ This page may combine multiple inventors who share the name “CHU CHENG-I”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
5 patentsUS12249592B2Mar 11, 2025
Dynamic bonding gap control and tool for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12211820B2Jan 28, 2025
Wafer bonding apparatus and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11990404B2May 21, 2024
Heat dissipation for semiconductor devices and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12040382B2Jul 16, 2024
Method of forming a nano-FET semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12489082B2Dec 2, 2025
Metal nanoparticles in an amorphous bonding layer between a device substrate and carrier substrate
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations49