P

Inventor

HUANG HUNG-YI

TW58 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HUNG-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

25 patents
US11158539B2Oct 26, 2021

Method and structure for barrier-less plug

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11107690B2Aug 31, 2021

Fin field-effect transistor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US11232945B2Jan 25, 2022

Conductive feature formation and structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11901183B2Feb 13, 2024

Fin field-effect transistor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12588268B2Mar 24, 2026

Liner-free conductive structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12557568B2Feb 17, 2026

Conductive feature formation and structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12341013B2Jun 24, 2025

Method and structure for barrier-less plug

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12087575B2Sep 10, 2024

Conductive feature formation and structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12057397B2Aug 6, 2024

Capping layer for liner-free conductive structures

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051592B2Jul 30, 2024

Method and structure for barrier-less plug

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11594609B2Feb 28, 2023

Liner-free conductive structures

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11521929B2Dec 6, 2022

Capping layer for liner-free conductive structures

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12431431B2Sep 30, 2025

Conductive structure interconnects with downward projections

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12394625B2Aug 19, 2025

Fin field-effect transistor device and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12002867B2Jun 4, 2024

Contact structure for semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11309213B2Apr 19, 2022

Method for manufacturing semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12538771B2Jan 27, 2026

Barrier layer for an interconnect structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12433006B2Sep 30, 2025

Semiconductor device with conductive liners over silicide structures and method of making the semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11817384B2Nov 14, 2023

Interconnect structure and manufacturing method for the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11222818B2Jan 11, 2022

Formation method of semiconductor device structure with metal-semiconductor compound region

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11217524B1Jan 4, 2022

Interconnect structure and manufacturing method for the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12494423B2Dec 9, 2025

Semiconductor device including stacked via contact and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12087642B2Sep 10, 2024

Selective dual silicide formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11676868B2Jun 13, 2023

Selective dual silicide formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10804097B2Oct 13, 2020

Conductive feature formation and structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

HTC CORP

11 patents

HUAWEI TECH CO LTD

7 patents

UNIV NAT CHENG KUNG

2 patents

HANNSTOUCH SOLUTION INC

2 patents

UNITED MICROELECTRONICS CORP

1 patent

LUKE HOK-SUM HORACE

1 patent

HUANG HUNG-YI

1 patent

Showing the top 50 of 58 patents by PatentIndex Score.