P

Inventor

HSIEH FENG-CHIEN

TW42 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH FENG-CHIEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

39 patents
US11482506B2Oct 25, 2022

Edge-trimming methods for wafer bonding and dicing

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations85
US11985438B2May 14, 2024

Pixel array including dark pixel sensors

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11810933B2Nov 7, 2023

Image sensor device and fabrication method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12364043B2Jul 15, 2025

Image sensor device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12593147B2Mar 31, 2026

Structures and methods for phase detection auto focus

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12575198B2Mar 10, 2026

Vertically arranged semiconductor pixel sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12469752B2Nov 11, 2025

Mid-manufacturing semiconductor wafer layer testing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12446338B2Oct 14, 2025

Method for manufacturing image sensor including forming FinFET transfer gate having a plurality of channel fins above a p-type region

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12408464B2Sep 2, 2025

Semiconductor arrangement with isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12407809B2Sep 2, 2025

Pixel array including dark pixel sensors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12386073B2Aug 12, 2025

Pixel array including time-of-flight sensors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12300664B2May 13, 2025

Edge-trimming methods for wafer bonding and dicing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12277795B2Apr 15, 2025

Optical fingerprint sensor with enhanced anti-counterfeiting features

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12243898B2Mar 4, 2025

Image sensor with high quantum efficiency

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12243894B2Mar 4, 2025

Stacked image sensors and methods of formation

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12211869B2Jan 28, 2025

Optical blocking structures for black level correction pixels in an image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12164034B2Dec 10, 2024

Pixel array including time-of-flight sensors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12166048B2Dec 10, 2024

Pixel array including octagon pixel sensors

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12154933B2Nov 26, 2024

Image sensors with stress adjusting layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12142630B2Nov 12, 2024

Vertically arranged semiconductor pixel sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051704B2Jul 30, 2024

Pixel array including octagon pixel sensors

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12033902B2Jul 9, 2024

Mid-manufacturing semiconductor wafer layer testing

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12021105B2Jun 25, 2024

Pixel array including octagon pixel sensors

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11996428B2May 28, 2024

Optical blocking structures for black level correction pixels in an image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11837619B2Dec 5, 2023

Semiconductor arrangement with isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670651B2Jun 6, 2023

Pixel array including octagon pixel sensors

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11527563B2Dec 13, 2022

Photodetector using a buried gate electrode for a transfer transistor and methods of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12382734B2Aug 5, 2025

Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12324254B2Jun 3, 2025

Back side illuminated image sensor device with select dielectric layers on the backside and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11810936B2Nov 7, 2023

Pixel array including air gap reflection structures

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12471408B2Nov 11, 2025

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12396285B2Aug 19, 2025

Integration of solar cell and image sensor

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10340300B2Jul 2, 2019

Image sensor with trenched filler grid

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations57
US12342647B2Jun 24, 2025

Semiconductor arrangement and method of making

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11769780B2Sep 26, 2023

Image sensors with stress adjusting layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12457812B2Oct 28, 2025

Semiconductor structure and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11837614B2Dec 5, 2023

Fast charge transfer floating diffusion region for a photodetector and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US11258971B2Feb 22, 2022

Multi-function transfer gate electrode for a photodetector and methods of operating the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9490288B2Nov 8, 2016

Image sensor with trenched filler grid within a dielectric grid including a reflective portion, a buffer and a high-K dielectric

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47

HSIEH FENG-CHIEN

2 patents

NEXPOWER TECHNOLOGY CORP

1 patent