Inventor

NG HONG WAN

SG67 patents

⚠️ This page may combine multiple inventors who share the name “NG HONG WAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NG HONG WAN

MICRON TECHNOLOGY INC

Stacked semiconductor die assemblies with die support members and associated systems and methods

Semiconductor device packages including a controller element

Memory devices with controllers under memory packages and associated systems and methods

Stacked semiconductor die assemblies with support members and associated systems and methods

Stacked semiconductor die assemblies with die support members and associated systems and methods

Overlapping die stacks for NAND package architecture

Semiconductor device assemblies including multiple shingled stacks of semiconductor dies

Semiconductor device assemblies including multiple shingled stacks of semiconductor dies

Through stack bridge bonding devices and associated methods

Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods

Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer

Stacked semiconductor die assemblies with support members and associated systems and methods

Memory devices with controllers under memory packages and associated systems and methods

Stacked semiconductor die assemblies with die support members and associated systems and methods

Build-up package for integrated circuit devices, and methods of making same

Stacked semiconductor die assemblies with support members and associated systems and methods

Semiconductor devices including a controller and methods of forming such devices

Memory devices with controllers under memory packages and associated systems and methods

Methods of manufacturing a semiconductor device package including a controller element

Build-up package for integrated circuit devices, and methods of making same

Build-up package for integrated circuit devices, and methods of making same

Nested semiconductor assemblies and methods for making the same

Surface mount device bonded to an inner layer of a multi-layer substrate

Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same

Semiconductor assemblies with systems and methods for managing high die stack structures

Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods

Three-dimensional bonding scheme and associated systems and methods

Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer

Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods

Stacked semiconductor die assemblies with support members and associated systems and methods

Stacked semiconductor die assemblies with die support members and associated systems and methods

Surface mount device bonded to an inner layer of a multi-layer substrate

Semiconductor assemblies with systems and methods for managing high die stack structures

Memory devices with controllers under memory packages and associated systems and methods

Semiconductor devices with multiple substrates and die stacks

Stacked semiconductor die assemblies with die support members and associated systems and methods

Semiconductor device assemblies including multiple shingled stacks of semiconductor dies

Overlapping die stacks for NAND package architecture

Overlapping die stacks for nand package architecture

Multi-chip package with enhanced conductive layer adhesion

Dielectric interposer with electrical-connection cut-in

Wire bonding for stacked memory dies

Flexible interposer for semiconductor dies

Microelectronic device packages and related methods and systems

Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices

NG HONG WAN

Build-up package for integrated circuit devices, and methods of making same

Build-up package for integrated circuit devices, and methods of making same

LOW PENG WANG

Microelectronic packages with small footprints and associated methods of manufacturing

LEE TECK KHENG

Microelectronic devices and microelectronic support devices, and associated assemblies and methods

CHONG CHIN HUI

Semiconductor assemblies with multi-level substrates and associated methods of manufacturing