Inventor
WADDEL MARJORIE L
US10 patents
Patents
10 patentsUS6533159B1Mar 18, 2003
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
MICRON TECHNOLOGY INC62 citations96
US6268275B1Jul 31, 2001
Method of locating conductive spheres utilizing screen and hopper of solder balls
MICRON TECHNOLOGY INC62 citations96
US6595408B1Jul 22, 2003
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux prior to placement
MICRON TECHNOLOGY INC30 citations92
US6551917B2Apr 22, 2003
Method of locating conductive spheres utilizing screen and hopper of solder balls
MICRON TECHNOLOGY INC22 citations92
US7635079B1Dec 22, 2009
System for locating conductive sphere utilizing screen and hopper of solder balls
MICRON TECHNOLOGY INC5 citations73
US7275676B2Oct 2, 2007
Apparatus for locating conductive spheres utilizing screen and hopper of solder balls
MICRON TECHNOLOGY INC6 citations73
US7105432B2Sep 12, 2006
Method of locating conductive spheres utilizing screen and hopper of solder balls
MICRON TECHNOLOGY INC6 citations73
US6957760B2Oct 25, 2005
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
MICRON TECHNOLOGY INC8 citations73
US6844216B2Jan 18, 2005
Method of attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
MICRON TECHNOLOGY INC6 citations73
US7644853B2Jan 12, 2010
Apparatus for attaching solder balls to BGA package utilizing a tool to pick and dip the solder ball in flux
MICRON TECHNOLOGY INC1 citations62