Inventor
NOGUCHI HAYATO
JP9 patents
Patents
9 patentsUS6398892B1Jun 4, 2002
Method of using pressure sensitive adhesive double coated sheet
LINTEC CORP91 citations97
US5976691ANov 2, 1999
Process for producing chip and pressure sensitive adhesive sheet for said process
LINTEC CORP42 citations95
US6718223B1Apr 6, 2004
Method of processing semiconductor wafer and semiconductor wafer supporting member
LINTEC CORP22 citations92
US6702910B2Mar 9, 2004
Process for producing a chip
LINTEC CORP36 citations92
US6436795B2Aug 20, 2002
Process for producing semiconductor chip
LINTEC CORP20 citations92
US6312800B1Nov 6, 2001
Pressure sensitive adhesive sheet for producing a chip
LINTEC CORP24 citations92
US6225194B1May 1, 2001
Process for producing chip and pressure sensitive adhesive sheet for said process
LINTEC CORP40 citations91
US5942578AAug 24, 1999
Energy beam curable pressure sensitive adhesive composition and use thereof
LINTEC CORP29 citations91
US7105226B2Sep 12, 2006
Pressure sensitive adhesive double coated sheet and method of use thereof
LINTEC CORP8 citations68