Inventor
LEE ELLIS
TW12 patents
⚠️ This page may combine multiple inventors who share the name “LEE ELLIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
11 patentsUS6492256B2Dec 10, 2002
Method for forming an interconnect structure with air gap compatible with unlanded vias
UNITED MICROELECTRONICS CORP56 citations96
US6492732B2Dec 10, 2002
Interconnect structure with air gap compatible with unlanded vias
UNITED MICROELECTRONICS CORP66 citations96
US6245635B1Jun 12, 2001
Method of fabricating shallow trench isolation
UNITED MICROELECTRONICS CORP20 citations92
US6171960B1Jan 9, 2001
Method of fabricating copper interconnection
UNITED MICROELECTRONICS CORP38 citations92
US6794752B2Sep 21, 2004
Bonding pad structure
UNITED MICROELECTRONICS CORP8 citations74
US6914318B2Jul 5, 2005
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same
UNITED MICROELECTRONICS CORP10 citations72
US6888247B2May 3, 2005
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same
UNITED MICROELECTRONICS CORP8 citations72
US6987057B2Jan 17, 2006
Method making bonding pad
UNITED MICROELECTRONICS CORP2 citations63
US6940146B2Sep 6, 2005
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same
UNITED MICROELECTRONICS CORP5 citations61
US7412394B2Aug 12, 2008
System and method for founding establishment through internet
UNITED MICROELECTRONICS CORP2 citations58
US6657283B2Dec 2, 2003
Reducing relative stress between HDP layer and passivation layer
UNITED MICROELECTRONICS CORP0 citations39