Inventor
HWANG TSING-FONG
TW6 patents
⚠️ This page may combine multiple inventors who share the name “HWANG TSING-FONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
5 patentsUS6380073B1Apr 30, 2002
Method for forming metal interconnection structure without corner faceted
UNITED MICROELECTRONICS CORP14 citations82
US6914318B2Jul 5, 2005
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same
UNITED MICROELECTRONICS CORP10 citations72
US6888247B2May 3, 2005
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same
UNITED MICROELECTRONICS CORP8 citations72
US6211048B1Apr 3, 2001
Method of reducing salicide lateral growth
UNITED MICROELECTRONICS CORP14 citations71
US6940146B2Sep 6, 2005
Interconnect structure with an enlarged air gaps disposed between conductive structures or surrounding a conductive structure within the same
UNITED MICROELECTRONICS CORP5 citations61