Inventor
SON HONG-SEONG
KR15 patents
⚠️ This page may combine multiple inventors who share the name “SON HONG-SEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS6983755B2Jan 10, 2006
Cleaning method and cleaning apparatus for performing the same
SAMSUNG ELECTRONICS CO LTD27 citations92
US7488235B2Feb 10, 2009
Polishing apparatus and related polishing methods
SAMSUNG ELECTRONICS CO LTD17 citations90
US7066785B2Jun 27, 2006
Polishing apparatus and related polishing methods
SAMSUNG ELECTRONICS CO LTD21 citations90
US6228739B1May 8, 2001
Pre-treatment method performed on a semiconductor structure before forming hemi-spherical grains of capacitor storage node
SAMSUNG ELECTRONICS CO LTD28 citations88
US7183226B2Feb 27, 2007
Method of forming a trench for use in manufacturing a semiconductor device
SAMSUNG ELECTRONICS CO LTD11 citations83
US6976902B2Dec 20, 2005
Chemical mechanical polishing apparatus
SAMSUNG ELECTRONICS CO LTD12 citations83
US6924207B2Aug 2, 2005
Method of fabricating a metal-insulator-metal capacitor
SAMSUNG ELECTRONICS CO LTD18 citations83
US7365021B2Apr 29, 2008
Methods of fabricating a semiconductor device using an organic compound and fluoride-based buffered solution
SAMSUNG ELECTRONICS CO LTD10 citations80
US7645695B2Jan 12, 2010
Method of manufacturing a semiconductor element
SAMSUNG ELECTRONICS CO LTD3 citations62
US6924234B2Aug 2, 2005
Method and apparatus for polishing a copper layer and method for forming a wiring structure using copper
SAMSUNG ELECTRONICS CO LTD6 citations61
US7807337B2Oct 5, 2010
Inductor for a system-on-a-chip and a method for manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations57
US8043960B2Oct 25, 2011
Contact structure of semiconductor devices and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US7026242B2Apr 11, 2006
Method for filling a hole with a metal
SAMSUNG ELECTRONICS CO LTD0 citations51