Inventor
YANG JEAN Y
US34 patents
⚠️ This page may combine multiple inventors who share the name “YANG JEAN Y”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED MICRO DEVICES INC
23 patentsUS6994939B1Feb 7, 2006
Semiconductor manufacturing resolution enhancement system and method for simultaneously patterning different feature types
ADVANCED MICRO DEVICES INC228 citations99
US6445030B1Sep 3, 2002
Flash memory erase speed by fluorine implant or fluorination
ADVANCED MICRO DEVICES INC212 citations99
US6927145B1Aug 9, 2005
Bitline hard mask spacer flow for memory cell scaling
ADVANCED MICRO DEVICES INC68 citations98
US6670241B1Dec 30, 2003
Semiconductor memory with deuterated materials
ADVANCED MICRO DEVICES INC79 citations98
US6541816B2Apr 1, 2003
Planar structure for non-volatile memory devices
ADVANCED MICRO DEVICES INC126 citations98
US6468865B1Oct 22, 2002
Method of simultaneous formation of bitline isolation and periphery oxide
ADVANCED MICRO DEVICES INC97 citations98
US7018868B1Mar 28, 2006
Disposable hard mask for memory bitline scaling
ADVANCED MICRO DEVICES INC95 citations97
US6555436B2Apr 29, 2003
Simultaneous formation of charge storage and bitline to wordline isolation
ADVANCED MICRO DEVICES INC56 citations96
US6465306B1Oct 15, 2002
Simultaneous formation of charge storage and bitline to wordline isolation
ADVANCED MICRO DEVICES INC46 citations96
US6653190B1Nov 25, 2003
Flash memory with controlled wordline width
ADVANCED MICRO DEVICES INC44 citations93
US6765254B1Jul 20, 2004
Structure and method for preventing UV radiation damage and increasing data retention in memory cells
ADVANCED MICRO DEVICES INC30 citations92
US6653191B1Nov 25, 2003
Memory manufacturing process using bitline rapid thermal anneal
ADVANCED MICRO DEVICES INC40 citations92
US6617215B1Sep 9, 2003
Memory wordline hard mask
ADVANCED MICRO DEVICES INC47 citations92
US6479348B1Nov 12, 2002
Method of making memory wordline hard mask extension
ADVANCED MICRO DEVICES INC31 citations92
US6933219B1Aug 23, 2005
Tightly spaced gate formation through damascene process
ADVANCED MICRO DEVICES INC19 citations84
US6989563B1Jan 24, 2006
Flash memory cell with UV protective layer
ADVANCED MICRO DEVICES INC9 citations74
US6620717B1Sep 16, 2003
Memory with disposable ARC for wordline formation
ADVANCED MICRO DEVICES INC10 citations74
US5888911AMar 30, 1999
HSQ processing for reduced dielectric constant
ADVANCED MICRO DEVICES INC11 citations74
US6720133B1Apr 13, 2004
Memory manufacturing process using disposable ARC for wordline formation
ADVANCED MICRO DEVICES INC10 citations73
US6706595B2Mar 16, 2004
Hard mask process for memory device without bitline shorts
ADVANCED MICRO DEVICES INC9 citations73
US5888898AMar 30, 1999
HSQ baking for reduced dielectric constant
ADVANCED MICRO DEVICES INC8 citations72
US6399984B1Jun 4, 2002
Species implantation for minimizing interface defect density in flash memory devices
ADVANCED MICRO DEVICES INC4 citations63
US6284600B1Sep 4, 2001
Species implantation for minimizing interface defect density in flash memory devices
ADVANCED MICRO DEVICES INC0 citations52
FASL LLC
6 patentsUS7033957B1Apr 25, 2006
ONO fabrication process for increasing oxygen content at bottom oxide-substrate interface in flash memory devices
FASL LLC62 citations96
US6803275B1Oct 12, 2004
ONO fabrication process for reducing oxygen vacancy content in bottom oxide layer in flash memory devices
FASL LLC46 citations96
US6955965B1Oct 18, 2005
Process for fabrication of nitride layer with reduced hydrogen content in ONO structure in semiconductor device
FASL LLC26 citations93
US6969886B1Nov 29, 2005
ONO fabrication process for reducing oxygen vacancy content in bottom oxide layer in flash memory devices
FASL LLC28 citations92
US6949481B1Sep 27, 2005
Process for fabrication of spacer layer with reduced hydrogen content in semiconductor device
FASL LLC50 citations92
US6884681B1Apr 26, 2005
Method of manufacturing a semiconductor memory with deuterated materials
FASL LLC31 citations92
SPANSION LLC
4 patentsUS7115469B1Oct 3, 2006
Integrated ONO processing for semiconductor devices using in-situ steam generation (ISSG) process
SPANSION LLC135 citations98
US7091088B1Aug 15, 2006
UV-blocking etch stop layer for reducing UV-induced charging of charge storage layer in memory devices in BEOL processing
SPANSION LLC26 citations92
US6894342B1May 17, 2005
Structure and method for preventing UV radiation damage in a memory cell and improving contact CD control
SPANSION LLC18 citations84
US6833581B1Dec 21, 2004
Structure and method for preventing process-induced UV radiation damage in a memory cell
SPANSION LLC13 citations84