Inventor

WANG LEJUN

US20 patents

⚠️ This page may combine multiple inventors who share the name “WANG LEJUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG LEJUN

INTEL CORP

Solder reflow with microwave energy

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material

Polybenzoxazine based wafer-level underfill material

Local control of underfill flow on high density packages, packages and systems made therewith, and methods of making same

Polybenzoxazine based wafer-level underfill material

Self-aligned mechanical joint between die and substrate exposed to mixed microwave energy

MEDTRONIC INC

Implantable medical device having a multi-axis magnetic sensor

Implantable medical device including a molded planar transformer

Method of forming a transformer assembly

Integrated circuit packaging for implantable medical devices

GEORGIA TECH RES INST

No-flow reworkable epoxy underfills for flip-chip applications

Reworkable epoxy underfill encapsulants

Thermally degradable epoxy underfills for flip-chip applications

JHM ENGINEERING AND TECH NINGBO CO LTD

Method and device for directly preparing foamed polylactic acid (PLA) product from PLA melt

Preparation method of high-rate foamed polylactic acid (PLA) sheet

ASKARINYA MOHSEN

Integrated circuit packaging for implantable medical devices

BOONE MARK R

Wafer level packages of high voltage units for implantable medical devices

TIANGONG UNIV

Method of preparing PAN-based carbon fibers

TIAN SUFENG

Fire retardant antiflux fiber and its production process