Inventor
HSIEH WAN-JUNG
TW4 patents
⚠️ This page may combine multiple inventors who share the name “HSIEH WAN-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
POWERTECH TECHNOLOGY INC
3 patentsUS7564123B1Jul 21, 2009
Semiconductor package with fastened leads
POWERTECH TECHNOLOGY INC16 citations80
US7619307B1Nov 17, 2009
Leadframe-based semiconductor package having arched bend in a supporting bar and leadframe for the package
POWERTECH TECHNOLOGY INC7 citations70
US7812430B2Oct 12, 2010
Leadframe and semiconductor package having downset baffle paddles
POWERTECH TECHNOLOGY INC0 citations48