P

Inventor

WEWERS DIETMAR

DE15 patents
⚠️ This page may combine multiple inventors who share the name “WEWERS DIETMAR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOLDSCHMIDT AG TH

12 patents
US4908274AMar 13, 1990

Polysiloxanes with (meth) acrylate ester groups linked through sic groups and their use as radiation-curable coating materials for flat carriers

GOLDSCHMIDT AG TH57 citations96
US4978726ADec 18, 1990

Polysiloxanes with (meth)acrylate ester groups linked over SiC groups and their use as radiation-curable coating materials for sheet-like carriers

GOLDSCHMIDT AG TH74 citations95
US5552506ASep 3, 1996

Organopolysiloxanes, modified with acrylate groups in the presence of a rhodium catalyst

GOLDSCHMIDT AG TH36 citations92
US5494979AFeb 27, 1996

Abhesive coating composition with an additive, which affects the degree of abhesiveness

GOLDSCHMIDT AG TH41 citations92
US5391679AFeb 21, 1995

Method for the synthesis of polyether siloxanes

GOLDSCHMIDT AG TH20 citations92
US5187251AFeb 16, 1993

Curable organopolysiloxanes having epoxy groups, methods of synthesizing them and their use as curable coating materials with abhesive properties

GOLDSCHMIDT AG TH26 citations92
US5034491AJul 23, 1991

(Meth)acrylate ester-modified organopolysiloxanes

GOLDSCHMIDT AG TH37 citations92
US4963438AOct 16, 1990

Coating composition and method for coating sheet-like supports by applying curable organopolysiloxanes modified with (Meth) acrylate ester groups

GOLDSCHMIDT AG TH48 citations92
US5208311AMay 4, 1993

Organopolysiloxanes with polyether and ester groups linked to a common spacer group

GOLDSCHMIDT AG TH10 citations73
US5189184AFeb 23, 1993

2-(3'-butenyl)-3,4-dihydro-2h-pyrans, their synthesis and use

GOLDSCHMIDT AG TH2 citations63
US4816541AMar 28, 1989

Method for the preparation of SiH-containing organopolysiloxanes

GOLDSCHMIDT AG TH6 citations63
US5281687AJan 25, 1994

Polysiloxanes with at least one sulfatohexyl group linked by an Si-C bond

GOLDSCHMIDT AG TH5 citations62

SIEMENS AG

2 patents

EVONIK GOLDSCHMIDT GMBH

1 patent