Inventor
SIMKA HARSONO S
US21 patents
⚠️ This page may combine multiple inventors who share the name “SIMKA HARSONO S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
12 patentsUS7682891B2Mar 23, 2010
Tunable gate electrode work function material for transistor applications
INTEL CORP19 citations92
US9932671B2Apr 3, 2018
Precursor and process design for photo-assisted metal atomic layer deposition (ALD) and chemical vapor deposition (CVD)
INTEL CORP10 citations84
US7354849B2Apr 8, 2008
Catalytically enhanced atomic layer deposition process
INTEL CORP13 citations83
US7858525B2Dec 28, 2010
Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill
INTEL CORP5 citations62
US7749906B2Jul 6, 2010
Using unstable nitrides to form semiconductor structures
INTEL CORP3 citations62
US7476615B2Jan 13, 2009
Deposition process for iodine-doped ruthenium barrier layers
INTEL CORP3 citations62
US7524765B2Apr 28, 2009
Direct tailoring of the composition and density of ALD films
INTEL CORP2 citations57
US8344352B2Jan 1, 2013
Using unstable nitrides to form semiconductor structures
INTEL CORP0 citations51
US8012878B2Sep 6, 2011
Atomic layer volatilization process for metal layers
INTEL CORP0 citations51
US7982204B2Jul 19, 2011
Using unstable nitrides to form semiconductor structures
INTEL CORP0 citations51
US7704895B2Apr 27, 2010
Deposition method for high-k dielectric materials
INTEL CORP1 citations51
US11769686B2Sep 26, 2023
Methods and apparatus for electroless plating dispense
INTEL CORP0 citations47
SAMSUNG ELECTRONICS CO LTD
5 patentsUS10381315B2Aug 13, 2019
Method and system for providing a reverse-engineering resistant hardware embedded security module
SAMSUNG ELECTRONICS CO LTD2 citations73
US11537898B2Dec 27, 2022
Generative structure-property inverse computational co-design of materials
SAMSUNG ELECTRONICS CO LTD5 citations72
US11043454B2Jun 22, 2021
Low resistivity interconnects with doped barrier layer for integrated circuits
SAMSUNG ELECTRONICS CO LTD3 citations72
US11087055B2Aug 10, 2021
Method of screening materials using forward conducting modes
SAMSUNG ELECTRONICS CO LTD3 citations71
US10916513B2Feb 9, 2021
Method and system for providing a reverse engineering resistant hardware embedded security module
SAMSUNG ELECTRONICS CO LTD0 citations62