Inventor

LAI YUNG-WEI

TW6 patents

⚠️ This page may combine multiple inventors who share the name “LAI YUNG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RITDISPLAY CORP

2 patents

US6758713B2Jul 6, 2004

Package method and apparatus for organic electro-luminescent display

RITDISPLAY CORP11 citations70

US7098097B2Aug 29, 2006

Mass-production packaging means and mass-production packaging method

RITDISPLAY CORP0 citations34

ZHANG QI

1 patent

US8205330B2Jun 26, 2012

Method for manufacturing a printed circuit board

ZHANG QI2 citations60

FUKUI PREC COMPONENT SHENZHEN

1 patent

US8052881B2Nov 8, 2011

Method of manufacturing multilayer printed circuit board having buried holes

FUKUI PREC COMPONENT SHENZHEN3 citations55

FOXCONN ADVANCED TECH INC

1 patent

US7985482B2Jul 26, 2011

Stiffener sheet and flexible printed circuit board using the same

FOXCONN ADVANCED TECH INC2 citations55

LIU RUI-WU

1 patent

US8453324B2Jun 4, 2013

Method of manufacturing FPCB substrate

LIU RUI-WU0 citations31