Inventor

RAZDAN SANDEEP

US29 patents

⚠️ This page may combine multiple inventors who share the name “RAZDAN SANDEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

RAZDAN SANDEEP

CISCO TECH INC

Photonic integrated circuit bonded with interposer

Photonics packaging platform

Wafer level optical probing structures for silicon photonics

Fan-out wafer level integration for photonic chips

Integrated circuit bridge for photonics and electrical chip integration

Periscope optical assembly

Passive fiber to chip coupling using post-assembly laser patterned waveguides

Photonic integrated circuit bonded with interposer

Low temperature solder in a photonic device

Frame lid for in-package optics

Electro-optical circuit

Integrated circuit bridge for photonics and electrical chip integration

Periscope optical assembly

Socket locator

Thermal packaging with fan out wafer level processing

Thermal packaging with fan out wafer level processing

Wafer-scale fabrication of optical apparatus

Connection features for electronic and optical packaging

INTEL CORP

Interconnect structures with polymer core

Optoelectronic device module having a silicon interposer

Flip chip package containing novel underfill materials

Interconnect structures with polymer core

Interconnect structures with polymer core

TYCO ELECTRONICS CORP

Optoelectronics structures

Interposer with separable interface

Mode size converters and methods of fabricating the same

RAMALINGAM SURIYAKALA

Techniques and configurations for surface treatment of an integrated circuit substrate

NAGARAJAN SIVAKUMAR

Fluxing-encapsulant material for microelectronic packages assembled via thermal compression bonding process

WARNER STEVEN B

Nanocomposite polymers