Inventor
SIMKA HARSONO
US12 patents
⚠️ This page may combine multiple inventors who share the name “SIMKA HARSONO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
8 patentsUS10957579B2Mar 23, 2021
Integrated circuit devices including a via and methods of forming the same
SAMSUNG ELECTRONICS CO LTD9 citations80
US12356665B2Jul 8, 2025
Stacked transistors having an isolation region therebetween and a common gate electrode, and related fabrication methods
SAMSUNG ELECTRONICS CO LTD2 citations72
US11289419B2Mar 29, 2022
Interconnects having long grains and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations62
US11705363B2Jul 18, 2023
Fully aligned via integration with selective catalyzed vapor phase grown materials
SAMSUNG ELECTRONICS CO LTD0 citations61
US11978668B2May 7, 2024
Integrated circuit devices including a via and methods of forming the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US12456647B2Oct 28, 2025
Nanosheet transistor devices and related fabrication methods
SAMSUNG ELECTRONICS CO LTD0 citations58
US10763207B2Sep 1, 2020
Interconnects having long grains and methods of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations51
US10825723B2Nov 3, 2020
Semiconductor device and method for making the same
SAMSUNG ELECTRONICS CO LTD0 citations40
INTEL CORP
3 patentsUS7220671B2May 22, 2007
Organometallic precursors for the chemical phase deposition of metal films in interconnect applications
INTEL CORP66 citations95
US7470617B2Dec 30, 2008
Treating a liner layer to reduce surface oxides
INTEL CORP20 citations88
US7851360B2Dec 14, 2010
Organometallic precursors for seed/barrier processes and methods thereof
INTEL CORP9 citations81