Inventor
LIANG JIM SHIH-CHUN
US16 patents
⚠️ This page may combine multiple inventors who share the name “LIANG JIM SHIH-CHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
8 patentsUS11244850B2Feb 8, 2022
On integrated circuit (IC) device simultaneously formed capacitor and resistor
IBM4 citations73
US10998263B2May 4, 2021
Back end of line (BEOL) time dependent dielectric breakdown (TDDB) mitigation within a vertical interconnect access (VIA) level of an integrated circuit (IC) device
IBM6 citations73
US11257750B2Feb 22, 2022
E-fuse co-processed with MIM capacitor
IBM3 citations72
US11145591B2Oct 12, 2021
Integrated circuit (IC) device integral capacitor and anti-fuse
IBM0 citations62
US11101213B2Aug 24, 2021
EFuse structure with multiple links
IBM0 citations62
US11437312B2Sep 6, 2022
High performance metal insulator metal capacitor
IBM0 citations60
US11688680B2Jun 27, 2023
MIM capacitor structures
IBM0 citations52
US9293365B2Mar 22, 2016
Hardmask removal for copper interconnects with tungsten contacts by chemical mechanical polishing
IBM0 citations51
GLOBALFOUNDRIES INC
8 patentsUS10354918B2Jul 16, 2019
Contact element structure of a semiconductor device
GLOBALFOUNDRIES INC2 citations71
US10347529B2Jul 9, 2019
Interconnect structures
GLOBALFOUNDRIES INC1 citations62
US10249534B2Apr 2, 2019
Method of forming a contact element of a semiconductor device and contact element structure
GLOBALFOUNDRIES INC0 citations50
US9633946B1Apr 25, 2017
Seamless metallization contacts
GLOBALFOUNDRIES INC1 citations49
US10403574B2Sep 3, 2019
Method to reduce resistance for a copper (Cu) interconnect landing on multilayered metal contacts, and semiconductor structures formed therefrom
GLOBALFOUNDRIES INC0 citations48
US10490501B2Nov 26, 2019
Method to form interconnect structure with tungsten fill
GLOBALFOUNDRIES INC0 citations41
US10741497B2Aug 11, 2020
Contact and interconnect structures
GLOBALFOUNDRIES INC0 citations40
US9793216B2Oct 17, 2017
Fabrication of IC structure with metal plug
GLOBALFOUNDRIES INC0 citations40