Inventor · disambiguated record
Tsung-Hsing Lu
Also filed as: LU TSUNG-HSING
16 granted patents·1 pending application·31 citations·filing 2016–2024
90Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD17
Top patents by PatentIndex Score
17 records- 0192US10892230B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 12, 2021·6 cites·20 claims
- 0291US11404383B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Aug 2, 2022·2 cites·20 claims
- 0390US10510633B1Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·4 cites·20 claims
- 0489US10373901B1Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 6, 2019·5 cites·20 claims
- 0587US10867881B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·3 cites·20 claims
- 0686US10304793B2Package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 28, 2019·5 cites·20 claims
- 0785US10506712B1Printed circuit boardTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·3 cites·19 claims
- 0880US12205859B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·20 claims
- 0978US12237226B2Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 25, 2025·0 cites·20 claims
- 1075US11990423B2Magnetic shielding material with insulator-coated ferromagnetic particlesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted May 21, 2024·0 cites·20 claims
- 1175US2024395621A1Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1273US11081392B2Dicing method for stacked semiconductor devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 3, 2021·1 cites·20 claims
- 1373US10912194B2Printed circuit boardTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 2, 2021·1 cites·20 claims
- 1472US11610827B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 21, 2023·0 cites·20 claims
- 1568US11101190B2Package and printed circuit board attachmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Aug 24, 2021·1 cites·19 claims
- 1664US12051624B2Stacked semiconductor devices and methods of forming thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 30, 2024·0 cites·20 claims
- 1758US11239143B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Feb 1, 2022·0 cites·20 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →