Inventor
ITOKAWA HAJIME
JP6 patents
Patents
6 patentsUS11802192B2Oct 31, 2023
Low dielectric resin substrate
SHINETSU CHEMICAL CO1 citations60
US12441892B2Oct 14, 2025
Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder
SHINETSU CHEMICAL CO0 citations59
US12098290B2Sep 24, 2024
Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder
SHINETSU CHEMICAL CO0 citations59
US11920011B2Mar 5, 2024
Resin substrate having dielectric characteristics with little frequency dependence
SHINETSU CHEMICAL CO1 citations59
US12540222B2Feb 3, 2026
Fluoroplastic substrate for high-speed communications and copper-clad fluoroplastic substrate for high-speed communications
SHINETSU CHEMICAL CO0 citations58
US12116304B2Oct 15, 2024
Method for packing quartz glass cloth
SHINETSU CHEMICAL CO0 citations58