Inventor
LIN SHENG-MOU
TW8 patents
Patents
8 patentsUS9881882B2Jan 30, 2018
Semiconductor package with three-dimensional antenna
MEDIATEK INC140 citations95
US10679949B2Jun 9, 2020
Semiconductor package assembly with redistribution layer (RDL) trace
MEDIATEK INC2 citations71
US10910323B2Feb 2, 2021
Semiconductor package with reduced noise
MEDIATEK INC0 citations61
US10340235B2Jul 2, 2019
Semiconductor package with three-dimensional antenna
MEDIATEK INC1 citations59
US12062864B2Aug 13, 2024
High gain and fan beam antenna structures
MEDIATEK INC0 citations57
US11764475B2Sep 19, 2023
High gain and fan beam antenna structures and associated antenna-in-package
MEDIATEK INC0 citations57
US10446508B2Oct 15, 2019
Semiconductor package integrated with memory die
MEDIATEK INC0 citations49
US10068857B2Sep 4, 2018
Semiconductor package assembly
MEDIATEK INC0 citations47