Inventor
LEE SI-WOO
US65 patents
⚠️ This page may combine multiple inventors who share the name “LEE SI-WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
44 patentsUS9754946B1Sep 5, 2017
Methods of forming an elevationally extending conductor laterally between a pair of conductive lines
MICRON TECHNOLOGY INC30 citations94
US11164872B1Nov 2, 2021
Underbody contact to horizontal access devices for vertical three-dimensional (3D) memory
MICRON TECHNOLOGY INC14 citations86
US11393820B2Jul 19, 2022
Vertical digit line for semiconductor devices
MICRON TECHNOLOGY INC6 citations85
US11367726B2Jun 21, 2022
Vertical digit lines for semiconductor devices
MICRON TECHNOLOGY INC7 citations85
US11227864B1Jan 18, 2022
Storage node after three-node access device formation for vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC12 citations85
US10366740B1Jul 30, 2019
Apparatuses having memory strings compared to one another through a sense amplifier
MICRON TECHNOLOGY INC6 citations84
US10347322B1Jul 9, 2019
Apparatuses having memory strings compared to one another through a sense amplifier
MICRON TECHNOLOGY INC10 citations84
US9761590B1Sep 12, 2017
Passing access line structure in a memory device
MICRON TECHNOLOGY INC8 citations84
US11257821B1Feb 22, 2022
Digit line and body contact for semiconductor devices
MICRON TECHNOLOGY INC6 citations75
US11769795B2Sep 26, 2023
Channel conduction in semiconductor devices
MICRON TECHNOLOGY INC2 citations73
US11641732B2May 2, 2023
Self-aligned etch back for vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC2 citations73
US11495604B2Nov 8, 2022
Channel and body region formation for semiconductor devices
MICRON TECHNOLOGY INC2 citations73
US11488981B2Nov 1, 2022
Array of vertical transistors and method used in forming an array of vertical transistors
MICRON TECHNOLOGY INC4 citations73
US11476251B2Oct 18, 2022
Channel integration in a three-node access device for vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC3 citations73
US11450693B2Sep 20, 2022
Single crystal horizontal access device for vertical three-dimensional (3D) memory and method of forming 3D memory
MICRON TECHNOLOGY INC3 citations73
US11342218B1May 24, 2022
Single crystalline silicon stack formation and bonding to a CMOS wafer
MICRON TECHNOLOGY INC4 citations73
US11329051B2May 10, 2022
Gate dielectric repair on three-node access device formation for vertical three-dimensional (3D) memory
MICRON TECHNOLOGY INC2 citations73
US11289491B1Mar 29, 2022
Epitaxtal single crystalline silicon growth for a horizontal access device
MICRON TECHNOLOGY INC5 citations73
US11239117B1Feb 1, 2022
Replacement gate dielectric in three-node access device formation for vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC4 citations73
US10734388B1Aug 4, 2020
Integrated assemblies having threshold-voltage-inducing-structures proximate gated-channel-regions, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC2 citations73
US9349737B2May 24, 2016
Passing access line structure in a memory device
MICRON TECHNOLOGY INC4 citations73
US11501804B2Nov 15, 2022
Microelectronic devices including semiconductive pillar structures, and related electronic systems
MICRON TECHNOLOGY INC2 citations72
US11309315B2Apr 19, 2022
Digit line formation for horizontally oriented access devices
MICRON TECHNOLOGY INC2 citations72
US10586586B1Mar 10, 2020
Apparatuses including threshold voltage compensated sense amplifiers and methods for compensating same
MICRON TECHNOLOGY INC6 citations72
US12575085B2Mar 10, 2026
Vertical digit lines for semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US12563717B2Feb 24, 2026
Vertical digit line for semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US12336288B2Jun 17, 2025
Array of vertical transistors and method used in forming an array of vertical transistors
MICRON TECHNOLOGY INC0 citations62
US12279410B2Apr 15, 2025
Epitaxial single crystalline silicon growth for a horizontal access device
MICRON TECHNOLOGY INC0 citations62
US12224201B2Feb 11, 2025
Single crystalline silicon stack formation and bonding to a cmos wafer
MICRON TECHNOLOGY INC0 citations62
US12150289B2Nov 19, 2024
Microelectronic devices and memory devices
MICRON TECHNOLOGY INC0 citations62
US12004341B2Jun 4, 2024
Recessed channel fin integration
MICRON TECHNOLOGY INC1 citations62
US11869803B2Jan 9, 2024
Single crystalline silicon stack formation and bonding to a CMOS wafer
MICRON TECHNOLOGY INC0 citations62
US11469232B2Oct 11, 2022
Epitaxial silicon within horizontal access devices in vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC1 citations62
US11469236B2Oct 11, 2022
DRAM circuitry, and integrated circuitry
MICRON TECHNOLOGY INC0 citations62
US11177265B2Nov 16, 2021
Integrated assemblies having threshold-voltage-inducing-structures proximate gated-channel-regions, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11171206B2Nov 9, 2021
Channel conduction in semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US10985165B2Apr 20, 2021
Methods of forming microelectronic devices
MICRON TECHNOLOGY INC1 citations62
US10535378B1Jan 14, 2020
Integrated assemblies which include non-conductive-semiconductor-material and conductive-semiconductor-material, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC1 citations62
US12526974B2Jan 13, 2026
Multiple, alternating epitaxial silicon for horizontal access devices in vertical three dimensional (3D) memory
MICRON TECHNOLOGY INC0 citations60
US12526976B2Jan 13, 2026
Vertical digit lines with alternating epitaxial silicon for horizontal access devices in 3D memory
MICRON TECHNOLOGY INC0 citations60
US11903183B2Feb 13, 2024
Conductive line contact regions having multiple multi-direction conductive lines and staircase conductive line contact structures for semiconductor devices
MICRON TECHNOLOGY INC0 citations59
US12507400B2Dec 23, 2025
Vertically stacked storage nodes and access devices with horizontal access lines
MICRON TECHNOLOGY INC0 citations52
US11849573B2Dec 19, 2023
Bottom electrode contact for a vertical three-dimensional memory
MICRON TECHNOLOGY INC0 citations52
US11812603B2Nov 7, 2023
Microelectronic devices including semiconductive pillar structures, and related electronic systems
MICRON TECHNOLOGY INC0 citations52
SAMSUNG ELECTRONICS CO LTD
2 patentsHYNIX SEMICONDUCTOR INC
2 patentsUS7667330B2Feb 23, 2010
Semiconductor device for preventing inflow of high current from an input/output pad and a circuit for preventing inflow of high current thereof
HYNIX SEMICONDUCTOR INC4 citations63
US7616415B2Nov 10, 2009
Electrostatic discharge protection circuit and electrostatic discharge protection method of a semiconductor memory device
HYNIX SEMICONDUCTOR INC4 citations60
KOREA ENERGY RESEARCH INST
1 patentLODESTAR LICENSING GROUP LLC
1 patentShowing the top 50 of 65 patents by PatentIndex Score.