Inventor
HO SYH-MING
TW5 patents
Patents
5 patentsUS5290909AMar 1, 1994
Polyimide composition for polyimide/copper foil laminate
IND TECH RES INST28 citations89
US5418066AMay 23, 1995
Polyimide composition for polyimide/copper foil laminate
IND TECH RES INST11 citations70
US5268432ADec 7, 1993
Heat resistant modified bismaleimide adhesive composition
IND TECH RES INST10 citations70
US5441815AAug 15, 1995
Process for producing easily removable polyimide resin film
IND TECH RES INST3 citations59
US5217599AJun 8, 1993
Bonding of polyimide film
IND TECH RES INST4 citations54