Inventor

QUESTAD DAVID LEE

US3 patents

Patents

3 patents

US6226187B1May 1, 2001

Integrated circuit package

IBM21 citations88

US6084299AJul 4, 2000

Integrated circuit package including a heat sink and an adhesive

IBM10 citations69

US5872337AFeb 16, 1999

Chip carrier and cable assembly reinforced at edges

IBM0 citations38