Inventor
TREVITT DONNA JEAN
US4 patents
Patents
4 patentsUS6226187B1May 1, 2001
Integrated circuit package
IBM21 citations88
US6046500AApr 4, 2000
Method of controlling the spread of an adhesive on a circuitized organic substrate
IBM15 citations77
US6084299AJul 4, 2000
Integrated circuit package including a heat sink and an adhesive
IBM10 citations69
US5910341AJun 8, 1999
Method of controlling the spread of an adhesive on a circuitized organic substrate
IBM14 citations69