Inventor

WU TIEN YUE

US3 patents

Patents

3 patents

US6403882B1Jun 11, 2002

Protective cover plate for flip chip assembly backside

IBM34 citations91

US6226187B1May 1, 2001

Integrated circuit package

IBM21 citations88

US6084299AJul 4, 2000

Integrated circuit package including a heat sink and an adhesive

IBM10 citations69