Inventor
ZIPPETELLI PATRICK ROBERT
US4 patents
Patents
4 patentsUS5953214ASep 14, 1999
Dual substrate package assembly coupled to a conducting member
IBM117 citations92
US6226187B1May 1, 2001
Integrated circuit package
IBM21 citations88
US6046911AApr 4, 2000
Dual substrate package assembly having dielectric member engaging contacts at only three locations
IBM44 citations87
US6084299AJul 4, 2000
Integrated circuit package including a heat sink and an adhesive
IBM10 citations69