Inventor
OH SEUNG-HYUN
KR57 patents
⚠️ This page may combine multiple inventors who share the name “OH SEUNG-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LUMENS CO LTD
22 patentsUSD865687SNov 5, 2019
LED package
LUMENS CO LTD8 citations79
US9933560B2Apr 3, 2018
Light emitting device package with an upper cover having an interval maintaining part, backlight unit, and method of manufacturing light emitting apparatus
LUMENS CO LTD2 citations71
US9831407B2Nov 28, 2017
Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
LUMENS CO LTD5 citations70
US10001592B2Jun 19, 2018
Backlight unit, double cone-shaped reflector, double cone-shaped reflector strip, illumination apparatus, and method of manufacturing double cone-shaped reflector
LUMENS CO LTD5 citations69
US9824952B2Nov 21, 2017
Light emitting device package strip
LUMENS CO LTD3 citations66
US11289459B2Mar 29, 2022
Apparatus and method for manufacturing light-emitting diode module
LUMENS CO LTD1 citations62
US11892159B2Feb 6, 2024
Surface light source module and method of manufacturing the same
LUMENS CO LTD0 citations58
USRE48474EMar 16, 2021
Light emitting device package and backlight unit comprising the same
LUMENS CO LTD0 citations58
US9142747B2Sep 22, 2015
Light emitting device package and backlight unit comprising the same
LUMENS CO LTD1 citations58
US10667345B2May 26, 2020
Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
LUMENS CO LTD0 citations50
US10222539B2Mar 5, 2019
Light emitting device package, backlight unit, and method of manufacturing light emitting apparatus
LUMENS CO LTD0 citations50
US9930750B2Mar 27, 2018
Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package
LUMENS CO LTD0 citations50
US10163870B2Dec 25, 2018
Light emitting device package and light emitting device package module
LUMENS CO LTD1 citations49
US10074788B2Sep 11, 2018
Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package
LUMENS CO LTD0 citations49
US9853017B2Dec 26, 2017
Light emitting device package and light emitting device package module
LUMENS CO LTD0 citations49
USRE47444EJun 18, 2019
Light emitting device package and backlight unit comprising the same
LUMENS CO LTD0 citations48
US11289633B2Mar 29, 2022
LED array package and manufacturing method thereof
LUMENS CO LTD0 citations46
US10790427B2Sep 29, 2020
Lens for light-emitting device and method of manufacturing light-emitting device package
LUMENS CO LTD0 citations46
US10784429B2Sep 22, 2020
Light emitting element package with thin film pad and manufacturing method thereof
LUMENS CO LTD0 citations46
US10177291B2Jan 8, 2019
Lens for light-emitting device and method of manufacturing light-emitting device package
LUMENS CO LTD0 citations46
US9741914B2Aug 22, 2017
Lens for light-emitting device and method of manufacturing light-emitting device package
LUMENS CO LTD0 citations46
US9748459B2Aug 29, 2017
Method for manufacturing improved chip-on-board type light emitting device package and such manufactured chip-on-board type light emitting device package
LUMENS CO LTD0 citations44
SAMSUNG ELECTRONICS CO LTD
11 patentsUS10359799B2Jul 23, 2019
Bandgap reference voltage generation circuit and bandgap reference voltage generation system
SAMSUNG ELECTRONICS CO LTD2 citations73
US9893738B2Feb 13, 2018
Analog-to-digital converter and communication device including the same
SAMSUNG ELECTRONICS CO LTD3 citations73
US11728961B2Aug 15, 2023
Clock generating circuit and wireless communication device including the same
SAMSUNG ELECTRONICS CO LTD2 citations72
US11031962B2Jun 8, 2021
Carrier aggregated signal transmission and reception
SAMSUNG ELECTRONICS CO LTD2 citations71
US10951445B2Mar 16, 2021
Radio frequency integrated circuit supporting carrier aggregation and wireless communication device including the same
SAMSUNG ELECTRONICS CO LTD5 citations71
US10951203B1Mar 16, 2021
Semiconductor device and method for controlling amplitude of signal in the semiconductor device
SAMSUNG ELECTRONICS CO LTD0 citations61
US10560128B2Feb 11, 2020
Carrier aggregated signal transmission and reception
SAMSUNG ELECTRONICS CO LTD1 citations61
US11018685B2May 25, 2021
Analog-to-digital converter and method of performing analog-to-digital conversion
SAMSUNG ELECTRONICS CO LTD0 citations52
US10303197B2May 28, 2019
Terminal device including reference voltage circuit
SAMSUNG ELECTRONICS CO LTD0 citations52
US10439636B2Oct 8, 2019
Delta modulator with variable feedback gain, analog-to-digital converter including the delta modulator, and communication device including the delta modulator
SAMSUNG ELECTRONICS CO LTD0 citations50
US10110248B2Oct 23, 2018
Delta modulator with variable feedback gain, analog-to-digital converter including the delta modulator, and communication device including the delta modulator
SAMSUNG ELECTRONICS CO LTD0 citations50
HYUNDAI MOTOR CO LTD
7 patentsUS11298999B2Apr 12, 2022
Suspension system for vehicle with composite spring
HYUNDAI MOTOR CO LTD4 citations73
US9932068B2Apr 3, 2018
Integrated power steering system for front and rear wheels of vehicle and control method thereof
HYUNDAI MOTOR CO LTD3 citations73
US10777846B2Sep 15, 2020
Method for preparing needle-like sulfide-based solid electrolyte
HYUNDAI MOTOR CO LTD2 citations72
US10767719B2Sep 8, 2020
Apparatus and method for assembling composite material leaf spring module
HYUNDAI MOTOR CO LTD2 citations72
US11353077B2Jun 7, 2022
Leaf spring
HYUNDAI MOTOR CO LTD0 citations62
US10766327B2Sep 8, 2020
Multi-plate spring suspension of composite material for vehicle
HYUNDAI MOTOR CO LTD0 citations52
US10564054B2Feb 18, 2020
Device for indicating replacement time of composite leaf spring
HYUNDAI MOTOR CO LTD0 citations52
LEE JONG-WOO
2 patentsUS9503117B2Nov 22, 2016
Semiconductor device comprising analog to digital converters sharing reference capacitor and system on chip comprising the same
LEE JONG-WOO3 citations72
US9722624B2Aug 1, 2017
Semiconductor device comprising successive approximation register analog to digital converter with variable sampling capacitor
LEE JONG-WOO3 citations71
KOREA ADVANCED INST SCI & TECH
2 patentsUS9417472B2Aug 16, 2016
Method for manufacturing colorless transparent glass-fabric reinforced polyimide film for flexible displays
KOREA ADVANCED INST SCI & TECH5 citations71
US9469735B2Oct 18, 2016
Method of manufacturing colorless transparent polyimide film having impregnated glass fabric and of flattening surface thereof
KOREA ADVANCED INST SCI & TECH2 citations60
OH SEUNG-HYUN
1 patentKIM YANG HEE
1 patentLG ELECTRONICS INC
1 patentHONG JUN-PYO
1 patentAUTOPHAGYSCIENCES INC
1 patentSOLIVIS INC
1 patentShowing the top 50 of 57 patents by PatentIndex Score.