P

Inventor

OH SEUNG-HYUN

KR57 patents
⚠️ This page may combine multiple inventors who share the name “OH SEUNG-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LUMENS CO LTD

22 patents
USD865687SNov 5, 2019

LED package

LUMENS CO LTD8 citations79
US9933560B2Apr 3, 2018

Light emitting device package with an upper cover having an interval maintaining part, backlight unit, and method of manufacturing light emitting apparatus

LUMENS CO LTD2 citations71
US9831407B2Nov 28, 2017

Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package

LUMENS CO LTD5 citations70
US10001592B2Jun 19, 2018

Backlight unit, double cone-shaped reflector, double cone-shaped reflector strip, illumination apparatus, and method of manufacturing double cone-shaped reflector

LUMENS CO LTD5 citations69
US9824952B2Nov 21, 2017

Light emitting device package strip

LUMENS CO LTD3 citations66
US11289459B2Mar 29, 2022

Apparatus and method for manufacturing light-emitting diode module

LUMENS CO LTD1 citations62
US11892159B2Feb 6, 2024

Surface light source module and method of manufacturing the same

LUMENS CO LTD0 citations58
USRE48474EMar 16, 2021

Light emitting device package and backlight unit comprising the same

LUMENS CO LTD0 citations58
US9142747B2Sep 22, 2015

Light emitting device package and backlight unit comprising the same

LUMENS CO LTD1 citations58
US10667345B2May 26, 2020

Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package

LUMENS CO LTD0 citations50
US10222539B2Mar 5, 2019

Light emitting device package, backlight unit, and method of manufacturing light emitting apparatus

LUMENS CO LTD0 citations50
US9930750B2Mar 27, 2018

Method for manufacturing light-emitting device packages, light-emitting device package strip, and light-emitting device package

LUMENS CO LTD0 citations50
US10163870B2Dec 25, 2018

Light emitting device package and light emitting device package module

LUMENS CO LTD1 citations49
US10074788B2Sep 11, 2018

Light emitting device package, backlight unit, illumination apparatus, and method of manufacturing light emitting device package

LUMENS CO LTD0 citations49
US9853017B2Dec 26, 2017

Light emitting device package and light emitting device package module

LUMENS CO LTD0 citations49
USRE47444EJun 18, 2019

Light emitting device package and backlight unit comprising the same

LUMENS CO LTD0 citations48
US11289633B2Mar 29, 2022

LED array package and manufacturing method thereof

LUMENS CO LTD0 citations46
US10790427B2Sep 29, 2020

Lens for light-emitting device and method of manufacturing light-emitting device package

LUMENS CO LTD0 citations46
US10784429B2Sep 22, 2020

Light emitting element package with thin film pad and manufacturing method thereof

LUMENS CO LTD0 citations46
US10177291B2Jan 8, 2019

Lens for light-emitting device and method of manufacturing light-emitting device package

LUMENS CO LTD0 citations46
US9741914B2Aug 22, 2017

Lens for light-emitting device and method of manufacturing light-emitting device package

LUMENS CO LTD0 citations46
US9748459B2Aug 29, 2017

Method for manufacturing improved chip-on-board type light emitting device package and such manufactured chip-on-board type light emitting device package

LUMENS CO LTD0 citations44

SAMSUNG ELECTRONICS CO LTD

11 patents
US10359799B2Jul 23, 2019

Bandgap reference voltage generation circuit and bandgap reference voltage generation system

SAMSUNG ELECTRONICS CO LTD2 citations73
US9893738B2Feb 13, 2018

Analog-to-digital converter and communication device including the same

SAMSUNG ELECTRONICS CO LTD3 citations73
US11728961B2Aug 15, 2023

Clock generating circuit and wireless communication device including the same

SAMSUNG ELECTRONICS CO LTD2 citations72
US11031962B2Jun 8, 2021

Carrier aggregated signal transmission and reception

SAMSUNG ELECTRONICS CO LTD2 citations71
US10951445B2Mar 16, 2021

Radio frequency integrated circuit supporting carrier aggregation and wireless communication device including the same

SAMSUNG ELECTRONICS CO LTD5 citations71
US10951203B1Mar 16, 2021

Semiconductor device and method for controlling amplitude of signal in the semiconductor device

SAMSUNG ELECTRONICS CO LTD0 citations61
US10560128B2Feb 11, 2020

Carrier aggregated signal transmission and reception

SAMSUNG ELECTRONICS CO LTD1 citations61
US11018685B2May 25, 2021

Analog-to-digital converter and method of performing analog-to-digital conversion

SAMSUNG ELECTRONICS CO LTD0 citations52
US10303197B2May 28, 2019

Terminal device including reference voltage circuit

SAMSUNG ELECTRONICS CO LTD0 citations52
US10439636B2Oct 8, 2019

Delta modulator with variable feedback gain, analog-to-digital converter including the delta modulator, and communication device including the delta modulator

SAMSUNG ELECTRONICS CO LTD0 citations50
US10110248B2Oct 23, 2018

Delta modulator with variable feedback gain, analog-to-digital converter including the delta modulator, and communication device including the delta modulator

SAMSUNG ELECTRONICS CO LTD0 citations50

HYUNDAI MOTOR CO LTD

7 patents

LEE JONG-WOO

2 patents

KOREA ADVANCED INST SCI & TECH

2 patents

OH SEUNG-HYUN

1 patent

KIM YANG HEE

1 patent

LG ELECTRONICS INC

1 patent

HONG JUN-PYO

1 patent

AUTOPHAGYSCIENCES INC

1 patent

SOLIVIS INC

1 patent

Showing the top 50 of 57 patents by PatentIndex Score.