Inventor
YAMAMOTO HISAMITSU
JP16 patents
⚠️ This page may combine multiple inventors who share the name “YAMAMOTO HISAMITSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UEMURA KOGYO KK
8 patentsUS10138558B2Nov 27, 2018
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same
UEMURA KOGYO KK3 citations69
US10927463B2Feb 23, 2021
Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board
UEMURA KOGYO KK0 citations61
US12503775B2Dec 23, 2025
Copper etching solution
UEMURA KOGYO KK0 citations56
US10450666B2Oct 22, 2019
Copper plating solution and copper plating method
UEMURA KOGYO KK1 citations53
US11421325B2Aug 23, 2022
Method for producing a printed wiring board
UEMURA KOGYO KK0 citations50
US10435778B2Oct 8, 2019
Surface treating apparatus
UEMURA KOGYO KK0 citations46
US12529145B2Jan 20, 2026
Pretreatment method for electroless plating, and pretreatment solution for electroless plating
UEMURA KOGYO KK0 citations44
US10773280B2Sep 15, 2020
Ultrasonic treatment apparatus
UEMURA KOGYO KK0 citations38
UYEMURA C & CO LTD
3 patentsUS9374913B2Jun 21, 2016
Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using same
UYEMURA C & CO LTD3 citations68
US9359676B2Jun 7, 2016
Surface treating apparatus
UYEMURA C & CO LTD3 citations67
US9120113B2Sep 1, 2015
Surface treating apparatus
UYEMURA C & CO LTD2 citations61
YAMAMOTO HISAMITSU
3 patentsUS8828131B2Sep 9, 2014
Catalyst application solution, electroless plating method using same, and direct plating method
YAMAMOTO HISAMITSU5 citations67
US8992756B2Mar 31, 2015
Direct plating method and solution for palladium conductor layer formation
YAMAMOTO HISAMITSU0 citations37
US8877020B2Nov 4, 2014
Electrolytic regeneration unit and electrolytic regeneration apparatus using same
YAMAMOTO HISAMITSU0 citations35