Inventor

OHSAKA SHINGO

JP8 patents

⚠️ This page may combine multiple inventors who share the name “OHSAKA SHINGO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI HOKKAI SEMICONDUCTOR

4 patents

US6437428B1Aug 20, 2002

Ball grid array type semiconductor package having a flexible substrate

HITACHI HOKKAI SEMICONDUCTOR9 citations81

US6887739B2May 3, 2005

Method of manufacturing semiconductor package including forming a resin sealing member

HITACHI HOKKAI SEMICONDUCTOR5 citations73

US6476466B2Nov 5, 2002

Ball grid array type semiconductor package having a flexible substrate

HITACHI HOKKAI SEMICONDUCTOR4 citations73

US6448111B1Sep 10, 2002

Method of manufacturing a semiconductor device

HITACHI HOKKAI SEMICONDUCTOR4 citations73

HITACHI LTD

2 patents

US6232650B1May 15, 2001

Semiconductor device having a chip mounted on a flexible substrate with separated insulation layers to prevent short-circuiting

HITACHI LTD94 citations98

US6590275B2Jul 8, 2003

Ball grid array type semiconductor package having a flexible substrate

HITACHI LTD10 citations82

RENESAS TECH CORP

2 patents

US6764878B2Jul 20, 2004

Method of manufacturing a resin encapsulated semiconductor device to provide a vent hole in a base substrate

RENESAS TECH CORP13 citations92

US6759279B2Jul 6, 2004

Method of manufacturing semiconductor device having resin sealing body

RENESAS TECH CORP2 citations62