Inventor
CAMPINI EDOARDO
US28 patents
⚠️ This page may combine multiple inventors who share the name “CAMPINI EDOARDO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
24 patentsUS6935868B1Aug 30, 2005
Adjustable-width, dual-connector card module
INTEL CORP89 citations98
US7714433B2May 11, 2010
Piezoelectric cooling of a semiconductor package
INTEL CORP38 citations92
US7458815B2Dec 2, 2008
Module to couple to a plurality of backplanes in a chassis
INTEL CORP33 citations91
US7272274B1Sep 18, 2007
Module to couple to an electrical and an optical backplane in a chassis
INTEL CORP21 citations91
US7133287B2Nov 7, 2006
ATCA integrated heatsink and core power distribution mechanism
INTEL CORP22 citations91
US7172432B2Feb 6, 2007
Stacked multiple connection module
INTEL CORP33 citations89
US7083422B2Aug 1, 2006
Switching system
INTEL CORP35 citations86
US7170753B2Jan 30, 2007
Interface enhancement for modular platform applications
INTEL CORP10 citations84
US7145774B2Dec 5, 2006
Backside cooling apparatus for modular platforms
INTEL CORP13 citations81
US7539184B2May 26, 2009
Reconfigurable interconnect/switch for selectably coupling network devices, media, and switch fabric
INTEL CORP14 citations80
US7183500B2Feb 27, 2007
Electromagnetic interference (EMI) filter with passive noise cancellation
INTEL CORP16 citations79
US7751333B2Jul 6, 2010
Method and apparatus to couple a module to a management controller on an interconnect
INTEL CORP5 citations72
US7266627B2Sep 4, 2007
Method and apparatus to couple a rear transition module to a carrier board
INTEL CORP7 citations72
US7359210B2Apr 15, 2008
Shock absorbing system for circuit boards
INTEL CORP5 citations63
US7551446B2Jun 23, 2009
Thermal management device attachment
INTEL CORP2 citations62
US7525219B2Apr 28, 2009
Providing power to a module
INTEL CORP3 citations62
US7255578B2Aug 14, 2007
Two-dimensional adjustable edge connector adaptor
INTEL CORP6 citations62
US8351198B2Jan 8, 2013
Telecommunications chassis having mezzanine card slots
INTEL CORP3 citations61
US7487280B2Feb 3, 2009
Enabling ports on a module received in a slot in a chassis
INTEL CORP3 citations61
US7336505B2Feb 26, 2008
Deployable faceplate label surface
INTEL CORP5 citations61
US7631133B2Dec 8, 2009
Backplane interconnection system and method
INTEL CORP4 citations58
US7941699B2May 10, 2011
Determining a set of processor cores to boot
INTEL CORP3 citations54
US7715208B2May 11, 2010
Configurable multi-faceted input/output panel
INTEL CORP1 citations52
US7450796B2Nov 11, 2008
Radiation switch
INTEL CORP0 citations40