P

Inventor

CAMPINI EDOARDO

US28 patents
⚠️ This page may combine multiple inventors who share the name “CAMPINI EDOARDO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

24 patents
US6935868B1Aug 30, 2005

Adjustable-width, dual-connector card module

INTEL CORP89 citations98
US7714433B2May 11, 2010

Piezoelectric cooling of a semiconductor package

INTEL CORP38 citations92
US7458815B2Dec 2, 2008

Module to couple to a plurality of backplanes in a chassis

INTEL CORP33 citations91
US7272274B1Sep 18, 2007

Module to couple to an electrical and an optical backplane in a chassis

INTEL CORP21 citations91
US7133287B2Nov 7, 2006

ATCA integrated heatsink and core power distribution mechanism

INTEL CORP22 citations91
US7172432B2Feb 6, 2007

Stacked multiple connection module

INTEL CORP33 citations89
US7083422B2Aug 1, 2006

Switching system

INTEL CORP35 citations86
US7170753B2Jan 30, 2007

Interface enhancement for modular platform applications

INTEL CORP10 citations84
US7145774B2Dec 5, 2006

Backside cooling apparatus for modular platforms

INTEL CORP13 citations81
US7539184B2May 26, 2009

Reconfigurable interconnect/switch for selectably coupling network devices, media, and switch fabric

INTEL CORP14 citations80
US7183500B2Feb 27, 2007

Electromagnetic interference (EMI) filter with passive noise cancellation

INTEL CORP16 citations79
US7751333B2Jul 6, 2010

Method and apparatus to couple a module to a management controller on an interconnect

INTEL CORP5 citations72
US7266627B2Sep 4, 2007

Method and apparatus to couple a rear transition module to a carrier board

INTEL CORP7 citations72
US7359210B2Apr 15, 2008

Shock absorbing system for circuit boards

INTEL CORP5 citations63
US7551446B2Jun 23, 2009

Thermal management device attachment

INTEL CORP2 citations62
US7525219B2Apr 28, 2009

Providing power to a module

INTEL CORP3 citations62
US7255578B2Aug 14, 2007

Two-dimensional adjustable edge connector adaptor

INTEL CORP6 citations62
US8351198B2Jan 8, 2013

Telecommunications chassis having mezzanine card slots

INTEL CORP3 citations61
US7487280B2Feb 3, 2009

Enabling ports on a module received in a slot in a chassis

INTEL CORP3 citations61
US7336505B2Feb 26, 2008

Deployable faceplate label surface

INTEL CORP5 citations61
US7631133B2Dec 8, 2009

Backplane interconnection system and method

INTEL CORP4 citations58
US7941699B2May 10, 2011

Determining a set of processor cores to boot

INTEL CORP3 citations54
US7715208B2May 11, 2010

Configurable multi-faceted input/output panel

INTEL CORP1 citations52
US7450796B2Nov 11, 2008

Radiation switch

INTEL CORP0 citations40

MOTOROLA INC

2 patents

CAMPINI EDOARDO

2 patents