Inventor
Chen xiao yun
CN3 patents
Patents
3 patentsUS8569110B2Oct 29, 2013
Pre-bonded substrate for integrated circuit package and method of making the same
MCMILLAN JOHN ROBERT0 citations43
US8513786B2Aug 20, 2013
Pre-bonded substrate for integrated circuit package and method of making the same
MCMILLAN JOHN ROBERT1 citations43
US8338924B2Dec 25, 2012
Substrate for integrated circuit package with selective exposure of bonding compound and method of making thereof
MCMILLAN JOHN ROBERT1 citations43