Inventor
AKIBA HIDEKI
JP17 patents
Patents
17 patentsUS7026382B2Apr 11, 2006
Conductive resin composition
SHINETSU CHEMICAL CO47 citations92
US8034893B2Oct 11, 2011
Resin resolution composition, polyimide resin, and semiconductor device
SHINETSU CHEMICAL CO9 citations83
US7147920B2Dec 12, 2006
Wafer dicing/die bonding sheet
SHINETSU CHEMICAL CO18 citations83
US10177059B2Jan 8, 2019
Method for manufacturing semiconductor apparatus using a base-attached encapsulant
SHINETSU CHEMICAL CO2 citations73
US9865518B2Jan 9, 2018
Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus
SHINETSU CHEMICAL CO2 citations73
US6949619B2Sep 27, 2005
Phenolic hydroxyl-bearing polyimide resin, making method and polyimide resin composition
SHINETSU CHEMICAL CO11 citations73
US7683152B2Mar 23, 2010
Partial block polyimide-polysiloxane copolymer, making method, and resin composition comprising the copolymer
SHINETSU CHEMICAL CO4 citations62
US10242924B2Mar 26, 2019
Base-attached encapsulant for semiconductor encapsulation, semiconductor apparatus
SHINETSU CHEMICAL CO0 citations52
US9449856B2Sep 20, 2016
Encapsulant with base for use in semiconductor encapsulation, semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO1 citations52
US9312197B2Apr 12, 2016
Support base-attached encapsulant, encapsulated substrate having semiconductor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations52
US9287174B2Mar 15, 2016
Fiber-containing resin substrate, device-mounting substrate and device-forming wafer, semiconductor apparatus, and method for producing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations52
US9129912B2Sep 8, 2015
Encapsulant, encapsulated substrate having semiconductor devices mounting thereon, encapsulated wafer having semiconductor devices forming thereon, semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations52
US7714080B2May 11, 2010
Primer composition for semiconductor-encapsulating epoxy resin molding compound and semiconductor device
SHINETSU CHEMICAL CO1 citations51
US9401290B2Jul 26, 2016
Semiconductor apparatus and method for producing the same
SHINETSU CHEMICAL CO0 citations41
US9129976B2Sep 8, 2015
Method of manufacturing semiconductor apparatus and semiconductor apparatus
SHINETSU CHEMICAL CO0 citations41
US8872358B2Oct 28, 2014
Sealant laminated composite, sealed semiconductor devices mounting substrate, sealed semiconductor devices forming wafer, semiconductor apparatus, and method for manufacturing semiconductor apparatus
SHINETSU CHEMICAL CO0 citations41
US10669197B2Jun 2, 2020
Surface-modified glass fiber film
SHINETSU CHEMICAL CO0 citations39