Inventor
NAKAMURA TOMOAKI
JP112 patents
⚠️ This page may combine multiple inventors who share the name “NAKAMURA TOMOAKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
16 patentsUS5845116ADec 1, 1998
Distributed computing system
HITACHI LTD111 citations99
US6615303B1Sep 2, 2003
Computer system with multiple operating system operation
HITACHI LTD100 citations98
US6715016B1Mar 30, 2004
Multiple operating system control method
HITACHI LTD54 citations95
US5274808ADec 28, 1993
Method and system for replacing program in uninterruptible computer system
HITACHI LTD60 citations95
US5901281AMay 4, 1999
Processing unit for a computer and a computer system incorporating such a processing unit
HITACHI LTD48 citations94
US6578064B1Jun 10, 2003
Distributed computing system
HITACHI LTD31 citations92
US5630135AMay 13, 1997
Multiple-execution method of multiple-version programs and computer system therefor
HITACHI LTD21 citations92
US6892261B2May 10, 2005
Multiple operating system control method
HITACHI LTD24 citations91
US7810096B2Oct 5, 2010
Computer executing multiple operating systems
HITACHI LTD17 citations84
US5579508ANov 26, 1996
Main memory managing method and apparatus in which main memory is partitioned into three distinct areas
HITACHI LTD19 citations82
US4563737AJan 7, 1986
Virtual storage management
HITACHI LTD22 citations82
US5787464AJul 28, 1998
Computer system including a dual memory configuration which supports on-line memory extraction and insertion
HITACHI LTD17 citations80
US6957434B2Oct 18, 2005
Distributed computing system
HITACHI LTD6 citations74
US5418404AMay 23, 1995
Data processing device and plug-in package
HITACHI LTD9 citations72
US5343009AAug 30, 1994
Data processing device and plug-in package
HITACHI LTD14 citations72
US5473776ADec 5, 1995
Data backup method and data processing system having data maintenance function
HITACHI LTD18 citations71
SEIKO EPSON CORP
13 patentsUS9851266B2Dec 26, 2017
Stress-detecting element, sensor module, and electronic apparatus
SEIKO EPSON CORP16 citations84
US9554775B2Jan 31, 2017
Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
SEIKO EPSON CORP7 citations84
US9099635B2Aug 4, 2015
Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
SEIKO EPSON CORP9 citations84
US9079220B2Jul 14, 2015
Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
SEIKO EPSON CORP10 citations84
US8344595B2Jan 1, 2013
Ultrasonic transducer, ultrasonic transducer array, and ultrasonic device
SEIKO EPSON CORP6 citations84
US10040098B2Aug 7, 2018
Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
SEIKO EPSON CORP2 citations73
US9592534B2Mar 14, 2017
Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
SEIKO EPSON CORP2 citations73
US9089872B2Jul 28, 2015
Ultrasonic transducer element chip, probe, electronic instrument, and ultrasonic diagnostic device
SEIKO EPSON CORP4 citations73
US11419579B2Aug 23, 2022
Ultrasonic sensor as well as probe and electronic apparatus
SEIKO EPSON CORP0 citations63
US9462995B2Oct 11, 2016
Biological testing device including ultrasonic wave transmitting/receiving part
SEIKO EPSON CORP2 citations63
US9456801B2Oct 4, 2016
Biological testing device
SEIKO EPSON CORP1 citations63
US9168025B2Oct 27, 2015
Ultrasonic probe and ultrasonic inspection apparatus
SEIKO EPSON CORP2 citations63
US8664830B2Mar 4, 2014
Ultrasonic device
SEIKO EPSON CORP1 citations63
TAIYO YUDEN KK
5 patentsUS10861649B2Dec 8, 2020
Ceramic electronic component and method of producing a ceramic electronic component
TAIYO YUDEN KK5 citations73
US11557434B2Jan 17, 2023
Ceramic electronic component and production method therefor
TAIYO YUDEN KK3 citations72
US10622151B2Apr 14, 2020
Electronic component and electronic component mounting circuit board
TAIYO YUDEN KK4 citations72
US11581140B2Feb 14, 2023
Ceramic electronic component and method of manufacturing the same
TAIYO YUDEN KK2 citations69
US9818543B2Nov 14, 2017
Electronic component, method of producing the same, and circuit substrate
TAIYO YUDEN KK4 citations64
NAKAMURA TOMOAKI
4 patentsUS8169855B2May 1, 2012
Ultrasonic sensor unit and electronic device
NAKAMURA TOMOAKI16 citations92
US8826748B2Sep 9, 2014
Stress-detecting element, sensor module, and electronic apparatus
NAKAMURA TOMOAKI8 citations84
US8803405B2Aug 12, 2014
Ultrasonic transducer, biological sensor, and method for manufacturing an ultrasonic transducer
NAKAMURA TOMOAKI5 citations84
US8536763B2Sep 17, 2013
Ultrasonic transducer, ultrasonic sensor, method of manufacturing ultrasonic transducer, and method of manufacturing ultrasonic sensor
NAKAMURA TOMOAKI7 citations84
KYOCERA CORP
2 patentsNEC CORP
2 patentsSHINETSU CHEMICAL CO
2 patentsUS10177059B2Jan 8, 2019
Method for manufacturing semiconductor apparatus using a base-attached encapsulant
SHINETSU CHEMICAL CO2 citations73
US9865518B2Jan 9, 2018
Electromagnetic wave shielding support base-attached encapsulant, encapsulated substrate having semicondutor devices mounted thereon, encapsulated wafer having semiconductor devices formed thereon, and semiconductor apparatus
SHINETSU CHEMICAL CO2 citations73
NAKANO MIKIO
1 patentFUNASAKA TSUKASA
1 patentTOKYO JAPAN
1 patentTSURUNO JIRO
1 patentSTRAWBERRY CORP KK
1 patentNIPPON THOMPSON CO LTD
1 patentShowing the top 50 of 112 patents by PatentIndex Score.