Inventor

HUA CHANG-HWANG

TW23 patents

⚠️ This page may combine multiple inventors who share the name “HUA CHANG-HWANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUA CHANG-HWANG

WIN SEMICONDUCTORS CORP

Method of using an electroless plating for depositing a metal seed layer for the subsequent plated backside metal film

Stacked structure of semiconductor chips having via holes and metal bumps

Fabrication method for producing semiconductor chips with enhanced die strength

Semiconductor integrated circuit

High breakdown voltage metal-insulator-metal capacitor

Structure of a semiconductor chip with substrate via holes and metal bumps and a fabrication method thereof

Semiconductor structure and method for forming the same

Structure for reducing compound semiconductor wafer distortion

Ohmic metal structure for GaN device

Transistor device and gate structure

Structure for reducing compound semiconductor wafer distortion

Gate-sinking pHEMTs having extremely uniform pinch-off/threshold voltage

Method for mounting a thinned semiconductor wafer on a carrier substrate

Structure of backside copper metallization for semiconductor devices and a fabrication method thereof

Method for fabricating a semiconductor integrated chip

Compound semiconductors having an improved high temperature resistant backside metallization

AVANTEK

Method of selective via-hole and heat sink plating using a metal mask

Method for the simultaneous formation of via-holes and wraparound plating on semiconductor chips

Method of forming completely metallized via holes in semiconductors

Method for forming self-aligned t-shaped transistor electrode

Rapid wafer thinning process

HUA CHANG-HWANG

Method of processing backside copper layer for semiconductor chips

CHEN JASON

Electroless plating apparatus and method