Inventor
NAKATANI KIMIHIKO
JP53 patents
⚠️ This page may combine multiple inventors who share the name “NAKATANI KIMIHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KOKUSAI ELECTRIC CORP
41 patentsUS11923193B2Mar 5, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP3 citations74
US11935742B2Mar 19, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11837466B2Dec 5, 2023
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11746416B2Sep 5, 2023
Method of processing substrate and manufacturing semiconductor device by forming film containing silicon
KOKUSAI ELECTRIC CORP3 citations73
US11626280B2Apr 11, 2023
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations73
US11183382B2Nov 23, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP2 citations73
US11158501B2Oct 26, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP4 citations73
US11417518B2Aug 16, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP4 citations72
US11527402B2Dec 13, 2022
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP4 citations71
US12581878B2Mar 17, 2026
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12525450B2Jan 13, 2026
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12494364B2Dec 9, 2025
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12400874B2Aug 26, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12331393B2Jun 17, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12281386B2Apr 22, 2025
Method of processing substrate for forming film containing silicon by supplying precursor containing Si—C bonds
KOKUSAI ELECTRIC CORP0 citations62
US12283478B2Apr 22, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12243753B2Mar 4, 2025
Method and apparatus for selective film formation in semiconductor substrate processing
KOKUSAI ELECTRIC CORP0 citations62
US12176216B2Dec 24, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12080550B2Sep 3, 2024
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12033852B2Jul 9, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11894239B2Feb 6, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11335554B2May 17, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations62
US11315800B2Apr 26, 2022
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11152215B2Oct 19, 2021
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11094532B2Aug 17, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US12278103B2Apr 15, 2025
Method of processing substrate and method of manufacturing semiconductor device by forming film
KOKUSAI ELECTRIC CORP0 citations61
US12255072B2Mar 18, 2025
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations61
US11978623B2May 7, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US11848203B2Dec 19, 2023
Methods of processing substrate and manufacturing semiconductor device by forming film, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations61
US12571094B2Mar 10, 2026
Method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US12381091B2Aug 5, 2025
Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations60
US12374544B2Jul 29, 2025
Processing method, method of manufacturing semiconductor device, processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11923191B2Mar 5, 2024
Method of manufacturing semiconductor device, method of processing substrate, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations60
US11699593B2Jul 11, 2023
Method of manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US12424463B2Sep 23, 2025
Method of processing substrate, method of manufacturing semiconductor device, substrate processing system, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
US12392031B2Aug 19, 2025
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations52
US12217959B2Feb 4, 2025
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US12080546B2Sep 3, 2024
Method of processing substrate, method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US11705326B2Jul 18, 2023
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US10804100B2Oct 13, 2020
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations52
US12494363B2Dec 9, 2025
Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
KOKUSAI ELECTRIC CORP0 citations49
HITACHI INT ELECTRIC INC
9 patentsUS9187826B2Nov 17, 2015
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC6 citations84
US9728409B2Aug 8, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC4 citations73
US9558937B2Jan 31, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC4 citations73
US9953830B2Apr 24, 2018
Method of manufacturing semiconductor device, substrate processing apparatus and recording medium
HITACHI INT ELECTRIC INC2 citations71
US9916976B2Mar 13, 2018
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations71
US10276393B2Apr 30, 2019
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations62
US10361084B2Jul 23, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, recording medium, and supply system
HITACHI INT ELECTRIC INC0 citations52
US10290542B2May 14, 2019
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations52
US9812355B2Nov 7, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations52
Showing the top 50 of 53 patents by PatentIndex Score.