Inventor
MAZUMDER MOHIUDDIN M
US7 patents
Patents
7 patentsUS6191472B1Feb 20, 2001
Hole geometry of a semiconductor package substrate
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US10678736B2Jun 9, 2020
Extending multichip package link off package
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US11599497B2Mar 7, 2023
High performance interconnect
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US10789201B2Sep 29, 2020
High performance interconnect
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US12386768B2Aug 12, 2025
Extending multichip package link off package
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US11386033B2Jul 12, 2022
Extending multichip package link off package
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US11113225B2Sep 7, 2021
Extending multichip package link off package
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