Inventor
BENAISSA LAMINE
FR28 patents
⚠️ This page may combine multiple inventors who share the name “BENAISSA LAMINE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
COMMISSARIAT ENERGIE ATOMIQUE
26 patentsUS9981420B2May 29, 2018
Sensor capable of sensing pressure by means of the deformation of a wrinkled piezoelectric layer
COMMISSARIAT ENERGIE ATOMIQUE7 citations82
US11329188B2May 10, 2022
Optoelectronic device manufacturing method
COMMISSARIAT ENERGIE ATOMIQUE3 citations72
US10886158B2Jan 5, 2021
Method for transferring structures
COMMISSARIAT ENERGIE ATOMIQUE3 citations72
US10734439B2Aug 4, 2020
Method for producing an optoelectronic device comprising a plurality of gallium nitride diodes
COMMISSARIAT ENERGIE ATOMIQUE2 citations71
US10357917B2Jul 23, 2019
Method for manufacturing nanometric objects using the rupture of a layer deformed by wrinkles
COMMISSARIAT ENERGIE ATOMIQUE1 citations71
US11127710B2Sep 21, 2021
Method for transferring structures
COMMISSARIAT ENERGIE ATOMIQUE2 citations65
US11442571B2Sep 13, 2022
Touch surface device
COMMISSARIAT ENERGIE ATOMIQUE0 citations60
US11171158B2Nov 9, 2021
SOI substrate compatible with the RFSOI and FDSOI technologies
COMMISSARIAT ENERGIE ATOMIQUE0 citations57
US11955375B2Apr 9, 2024
Composite structure, intended for a planar co-integration of electronic components of different functions
COMMISSARIAT ENERGIE ATOMIQUE0 citations51
US10183441B2Jan 22, 2019
Method for obtaining a wavy layer locally suspended on a substrate using a deformation by formation of wrinkles
COMMISSARIAT ENERGIE ATOMIQUE0 citations50
US11024544B2Jun 1, 2021
Assembly for 3D circuit with superposed transistor levels
COMMISSARIAT ENERGIE ATOMIQUE0 citations49
US10115698B2Oct 30, 2018
Method for direct adhesion via low-roughness metal layers
COMMISSARIAT ENERGIE ATOMIQUE1 citations49
US10032742B2Jul 24, 2018
Method for obtaining a bonding surface for direct bonding
COMMISSARIAT ENERGIE ATOMIQUE0 citations49
US12234144B2Feb 25, 2025
Method for sealing cavities using membranes
COMMISSARIAT ENERGIE ATOMIQUE0 citations48
US10403597B2Sep 3, 2019
Direct bonding method
COMMISSARIAT ENERGIE ATOMIQUE0 citations48
US11401162B2Aug 2, 2022
Method for transferring a useful layer into a supporting substrate
COMMISSARIAT ENERGIE ATOMIQUE0 citations47
US10586810B2Mar 10, 2020
SOI substrate compatible with the RFSOI and FDSOI technologies
COMMISSARIAT ENERGIE ATOMIQUE0 citations47
US11601107B2Mar 7, 2023
Method for the production of a bulk acoustic wave resonator with a reduced parasitic capacitance
COMMISSARIAT ENERGIE ATOMIQUE0 citations46
US11380577B2Jul 5, 2022
Method for transferring a thin layer using a filled preceramic polymer
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US9777393B2Oct 3, 2017
Method for producing a single-crystalline layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations41
US9997394B2Jun 12, 2018
Method for transferring a thin layer with supply of heat energy to a fragile zone via an inductive layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations40
US10710192B2Jul 14, 2020
Method for adhering a first structure and a second structure
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US10679963B2Jun 9, 2020
Method for assembling two substrates of different natures via a ductile intermediate layer
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US9922953B2Mar 20, 2018
Process for producing a structure by assembling at least two elements by direct adhesive bonding
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US9472530B2Oct 18, 2016
Method for carrying out a conductive direct metal bonding
COMMISSARIAT ENERGIE ATOMIQUE0 citations39
US9735038B2Aug 15, 2017
Process for manufacturing a semiconductor structure with temporary bonding via metal layers
COMMISSARIAT ENERGIE ATOMIQUE0 citations34