Inventor

HUANG HUI-CHI

TW40 patents

⚠️ This page may combine multiple inventors who share the name “HUANG HUI-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG HUI-CHI

TAIWAN SEMICONDUCTOR MFG CO LTD

Planarization process for forming semiconductor device structure

Methods of forming contact feature

Semiconductor structure with doped contact plug and method for forming the same

Detecting the cleanness of wafer after post-CMP cleaning

Composition and method for polishing and integrated circuit

Semiconductor device structure with an interconnect structure in a dielectric layer with multiple hydrophobic layers along sidewalls of the dielectric layer, and method for forming the same

Self-healing polishing pad

Methods to clean chemical mechanical polishing systems

Semiconductor device structure with interconnect structure and method for forming the same

Self-healing polishing pad

Methods to clean chemical mechanical polishing systems

Semiconductor device structure with interconnect structure and method for forming the same

Methods and systems for chemical mechanical polish cleaning

Chemical mechanical polish slurry and method of manufacture

Slurry composition and method for polishing and integrated circuit

Chemical mechanical polishing method

Mega-sonic vibration assisted chemical mechanical planarization

Chemical mechanical polishing apparatus and method

Magnetic slurry for highly efficiency CMP

Mega-sonic vibration assisted chemical mechanical planarization

Chemical mechanical polishing method

Magnetic slurry for highly efficient CMP

Chemical mechanical polish slurry and method of manufacture

Chemical mechanical polishing apparatus and method

Compositions for use in chemical mechanical polishing

Processing tool and method

Bevel edge removal methods, tools, and systems

Bevel edge removal methods, tools, and systems

Chemical mechanical planarization tool

Chemical mechanical planarization tool

Chemical mechanical polishing method

Detecting the cleanness of wafer after post-CMP cleaning

Methods and systems for chemical mechanical polish cleaning

Multiple metallization scheme

Wafer edge trimming process including water jet and wedge separation and methods thereof

Electrical cleaning tool for wafer polishing tool system

TAIWAN SEMICONDUCTOR MFG

Adaptive endpoint method for pad life effect on chemical mechanical polishing

Systems and methods for chemical mechanical planarization with fluorescence detection

LIU CHIA-CHU

Field effect transistors and method of forming the same

LEE CHU-AN

Adaptive endpoint method for pad life effect on chemical mechanical polishing