Inventor
HWANG JUN HA
KR16 patents
⚠️ This page may combine multiple inventors who share the name “HWANG JUN HA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KCTECH CO LTD
7 patentsUS11384255B2Jul 12, 2022
Polishing slurry composition for STI process
KCTECH CO LTD4 citations69
US12037516B2Jul 16, 2024
Polishing slurry composition and method for producing same
KCTECH CO LTD0 citations58
US10494547B2Dec 3, 2019
Additive composition and positive polishing slurry composition including the same
KCTECH CO LTD1 citations57
US12503622B2Dec 23, 2025
Cerium-based particle and polishing slurry composition including the same
KCTECH CO LTD0 citations53
US12031062B2Jul 9, 2024
Polishing slurry composition for sti process
KCTECH CO LTD0 citations48
US12528974B2Jan 20, 2026
Polishing slurry composition
KCTECH CO LTD0 citations44
US10421883B2Sep 24, 2019
Abrasive particle-dispersion layer composite and polishing slurry composition including the same
KCTECH CO LTD0 citations36
SAMSUNG ELECTRONICS CO LTD
4 patentsUS11279852B2Mar 22, 2022
CMP slurry compositions and methods of fabricating a semiconductor device using the same
SAMSUNG ELECTRONICS CO LTD0 citations59
US11928363B2Mar 12, 2024
Operating method of host device and storage device and storage device
SAMSUNG ELECTRONICS CO LTD0 citations56
US12444450B2Oct 14, 2025
Memory device and method for managing dynamic voltage frequency scaling operations based on host configuration
SAMSUNG ELECTRONICS CO LTD0 citations48
US10435587B2Oct 8, 2019
Polishing compositions and methods of manufacturing semiconductor devices using the same
SAMSUNG ELECTRONICS CO LTD0 citations47