Inventor
HAZEYAMA ICHIRO
JP14 patents
⚠️ This page may combine multiple inventors who share the name “HAZEYAMA ICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC CORP
7 patentsUS6998704B2Feb 14, 2006
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
NEC CORP86 citations97
US5714112AFeb 3, 1998
Process for producing a silica sintered product for a multi-layer wiring substrate
NEC CORP43 citations95
US7230328B2Jun 12, 2007
Semiconductor package and laminated semiconductor package
NEC CORP22 citations92
US6348424B1Feb 19, 2002
Low-temperature calcined glass ceramic and a manufacturing process therefor
NEC CORP13 citations73
US5902758AMay 11, 1999
Low temperature firing glass-ceramic substrate and production process thereof
NEC CORP12 citations73
US5728470AMar 17, 1998
Multi-layer wiring substrate, and process for producing the same
NEC CORP4 citations62
US7594644B2Sep 29, 2009
Semiconductor device and method for manufacturing the same, circuit board, electronic apparatus, and semiconductor device manufacturing apparatus
NEC CORP0 citations51
JAPAN E M CO LTD
3 patentsUS6926188B2Aug 9, 2005
Transfer apparatus for arraying small conductive bumps on a substrate and/ or chip
JAPAN E M CO LTD15 citations82
US6889886B2May 10, 2005
Transfer apparatus for arraying small conductive bumps on substrate and/ or chip
JAPAN E M CO LTD12 citations82
US7119438B2Oct 10, 2006
Method of arranging microspheres with liquid, microsphere arranging device, and semiconductor device
JAPAN E M CO LTD3 citations53