Inventor
IKUINA KAZUHIRO
JP14 patents
Patents
14 patentsUS6774748B1Aug 10, 2004
RF package with multi-layer substrate having coplanar feed through and connection interface
NEC CORP125 citations98
US6130111AOct 10, 2000
Packaged semiconductor device and method of manufacturing the same
NEC CORP57 citations96
US5952712ASep 14, 1999
Packaged semiconductor device and method of manufacturing the same
NEC CORP49 citations96
US5714112AFeb 3, 1998
Process for producing a silica sintered product for a multi-layer wiring substrate
NEC CORP43 citations95
US6903700B2Jun 7, 2005
High frequency circuit substrate and method for forming the same
NEC CORP23 citations92
US6348424B1Feb 19, 2002
Low-temperature calcined glass ceramic and a manufacturing process therefor
NEC CORP13 citations73
US5948192ASep 7, 1999
Glass-ceramic substrate and method of producing the same
NEC CORP7 citations73
US5902758AMay 11, 1999
Low temperature firing glass-ceramic substrate and production process thereof
NEC CORP12 citations73
US5753376AMay 19, 1998
Multilayer glass ceramic substrate and process for producing the same
NEC CORP7 citations73
US5506058AApr 9, 1996
Mutlilayer glass ceramic substrate and method of fabricating the same
NEC CORP10 citations73
US6467137B1Oct 22, 2002
Method of manufacturing an ink jet recording head
NEC CORP10 citations70
US5989484ANov 23, 1999
Multilayer glass ceramic substrate and process for producing the same
NEC CORP4 citations62
US5757062AMay 26, 1998
Ceramic substrate for semiconductor device
NEC CORP2 citations62
US5728470AMar 17, 1998
Multi-layer wiring substrate, and process for producing the same
NEC CORP4 citations62