Inventor · disambiguated record

Chih-Chung Lilang

Also filed as: LILANG CHIH-CHUNG

0 granted patents·1 pending application·0 citations·filing 2013–2013

Technology areasH10P

Files withJIANGSU CHANGJIANG ELECTRONICS1

Top patents by PatentIndex Score

1 record

0133US2016163622A1Packaging-before-etching flip chip 3d system-level metal circuit board structure and technique thereofJIANGSU CHANGJIANG ELECTRONICS·Filed 2013·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →